Buch, Englisch, 607 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 9708 g
Device Design, Process Integration, Characterization, and Reliability
Buch, Englisch, 607 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 9708 g
ISBN: 978-1-4939-5398-1
Verlag: Springer US
This book covers modern analog components, their characteristics, and interactions with process parameters. It serves as a comprehensive guide, addressing both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. Based on the authors’ extensive experience in the development of analog devices, this book is intended for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science.
Zielgruppe
Professional/practitioner
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Halb- und Supraleitertechnologie
- Naturwissenschaften Physik Elektromagnetismus Halbleiter- und Supraleiterphysik
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Transistoren
Weitere Infos & Material
The World Is Analog.- Review of Single-Crystal Silicon Properties.- PN Junctions.- Rectifying and Ohmic Contacts.- Bipolar and Junction Field-Effect Transistors.- High-Voltage and Power Transistors.- Passive Components.- Process Integration.- Mismatch and Noise.- Chip Reliability.