Silicon Analog Components

Device Design, Process Integration, Characterization, and Reliability
2. Auflage 2020
ISBN: 978-3-030-15087-7
Verlag: Springer International Publishing

Buch, Englisch, 648 Seiten, Paperback, Format (B × H): 155 mm x 235 mm, Gewicht: 1042 g

This book covers modern analog components, their characteristics, and interactions with process parameters. It serves as a comprehensive guide, addressing both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. Based on the authors’ extensive experience in the development of analog devices, this book is intended for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science.

- Enables engineers to understand analog device physics, and discusses important relations between process integration, device design, component characteristics, and reliability;

- Describes in step-by-step fashion the components that are used in analog designs, the particular characteristics of analog components, while comparing them to digital applications;

- Explains the second-order effects in analog devices, and trade-offs between these effects when designing components and developing an integrated process for their manufacturing.

Zielgruppe

Graduate

Autoren/Hrsg.

Hutter, Lou N.

El-Kareh, Badih

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Transistoren
• Naturwissenschaften Physik Elektromagnetismus Halbleiter- und Supraleiterphysik
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Halb- und Supraleitertechnologie

Inhaltsverzeichnis

The World Is Analog.- Review of Single-Crystal Silicon Properties.- PN Junctions.- Rectifying and Ohmic Contacts.- Bipolar and Junction Field-Effect Transistors.- Analog/RF CMOS.- High-Voltage and Power Transistors.- Passive Components.- Process Integration.- Mismatch and Noise.- Chip Reliability.

Über Autor(innen)

Dr. Badih El-Kareh is an independent consultant, retired IBM and Texas Instruments physicist. He has over 40 years’ experience in semiconductor device design, process integration, and characterization. This includes the development of advanced CMOS and BiCMOS processes and devices for analog, memory, digital, and high-voltage applications. He has 30 years’ experience in academic and industrial teaching and is author of a book on VLSI Silicon Devices, a book on Modern Semiconductor Processing Technologies, and a book on Silicon Devices and Process Integration. He authored and co-authored 35 papers and has 52 US patents issued. Dr. El-Kareh is a senior member of the IEEE.

Lou Hutter has almost 35 years of experience in the semiconductor industry. As Director of the Mixed-Signal Technology Development group at TI, he was responsible for all analog, mixed-signal, RF, and power technology development in the company, supporting every major business unit. After retiringfrom TI in 2007, he became the General Manager of the Analog Foundry business unit at Dongbu HiTek, a S. Korean foundry, where he was a Senior VP. He was elected a TI Fellow in 1995, holds 47 U.S. patents, and has co-authored over 30 papers. His focus areas have been in high-performance analog CMOS, high-power BCD technology, power metallization, SiGe BiCMOS, technology road-mapping, and technology development methodology.