Hybrid Microcircuit Technology Handbook

Materials, Processes, Design, Testing and Production
2. Auflage 1998
ISBN: 978-0-8155-1423-7
Verlag: William Andrew Publishing

Buch, Englisch, 600 Seiten, Format (B × H): 152 mm x 229 mm, Gewicht: 1230 g

The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.

Zielgruppe

Materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise

Inhaltsverzeichnis

IntroductionSubstratesThin Film ProcessesThick Film ProcessesResistor TrimmingParts SelectionAssembly ProcessesTestingHandling and Clean RoomsDesign GuidelinesDocumentation and SpecificationsFailure AnalysisMultichip Modules: A New Breed of Hybrid MicrocircuitsReferencesIndex