Practical Guide to the Packaging of Electronics

Thermal and Mechanical Design and Analysis, Third Edition
3. Auflage 2021
ISBN: 978-1-032-09782-4
Verlag: CRC Press

Buch, Englisch, 374 Seiten, Format (B × H): 156 mm x 234 mm, Gewicht: 570 g

Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems

A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration.

Additionally, the author:

- Addresses various cross-discipline issues in the design of electromechanical products

- Provides a solid foundation for heat transfer, vibration, and life expectancy calculations

- Identifies reliability issues and concerns

- Develops the ability to conduct a more thorough analysis for the final design

- Includes design tips and guidelines for each aspect of electronics packaging

Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, – electrical or quality engineering.

Zielgruppe

Professional Practice & Development

Autoren/Hrsg.

Jamnia, Ali

Fachgebiete

• Technische Wissenschaften Bauingenieurwesen Bauingenieurwesen
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Maschinenbau

Inhaltsverzeichnis

Introduction. Basic Heat Transfer—Conduction, Convection, and Radiation. Conductive Cooling. Radiation Cooling. Fundamentals of Convection Cooling. Combined Modes, Transient Heat Transfer, and Advanced Materials. Basics of Vibration and Its Isolation. Basics of Shock Management. Induced Stresses. The Finite Element Methods. Mechanical and Thermomechanical Concerns. Acoustics. Mechanical Failures and Reliability. Electrical Failures and Reliability. Chemical Attack Failures and Reliability Concerns. Reliability Models, Predictions, and Calculations. Design Considerations in an Avionics Electronic Package.
Appendices. References.

Über Autor(innen)

Ali Jamnia enjoys teaching and mentoring junior engineers. His primary expertise lies in electromechanical systems design and development. In addition, he enjoys conducting analysis of various engineering problems using numerical approximations and computer simulations. Dr. Jamnia has focused on the issues of electronics packaging since the early 1990s, and since 1995, has been involved with the development of innovative electronics systems to aid individuals with either physical or cognitive disabilities. In fact, his prime achievement has been the development of a specialized computer system called the Learning StationTM - used as a teaching tool for individuals with cognitive disabilities.