Jamnia Practical Guide to the Packaging of Electronics

Thermal and Mechanical Design and Analysis, Third Edition
3. Auflage 2016
ISBN: 978-1-4987-5402-6
Verlag: CRC Press
Format: PDF
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)

E-Book, Englisch, 376 Seiten

Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems

A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration.

Additionally, the author:

- Addresses various cross-discipline issues in the design of electromechanical products

- Provides a solid foundation for heat transfer, vibration, and life expectancy calculations

- Identifies reliability issues and concerns

- Develops the ability to conduct a more thorough analysis for the final design

- Includes design tips and guidelines for each aspect of electronics packaging

Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, – electrical or quality engineering.

Autoren/Hrsg.

Jamnia, Ali

Fachgebiete

• Technische Wissenschaften Maschinenbau | Werkstoffkunde Maschinenbau
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik

Inhaltsverzeichnis

Introduction
Issues in Electronics Packaging Design
Technical Management Issues

Basic Heat Transfer—Conduction, Convection, and Radiation
Basic Equations and Concepts
General Equations
Nondimensional Groups

Conductive Cooling
Introduction
Thermal Resistance

Heat Spreading

Junction-to-Case Resistance
Contact Interface Resistance
2D or 3D Heat Conduction

Radiation Cooling

Introduction

Factors Influencing Radiation

Examples and Illustrations
Cabinet Surface Temperature
A Few Design Tips

Fundamentals of Convection Cooling
Introduction
Free (or Natural) Convection
Fin Design
Forced Convection
Indirect Flow System Design

Combined Modes, Transient Heat Transfer, and Advanced
Materials

Introduction

Total System Resistance

Time-Dependent Temperature Variation

Advanced Materials and Technologies

Basics of Vibration and Its Isolation
Introduction

Periodic and Harmonic Motions

Free Vibration

Forced Vibration

Random Vibration

Vibrations and Mechanical Stresses Caused by Acoustics and Noise

Multiple DOF Systems

A Few Words on Advanced and Active Isolation Techniques

Basics of Shock Management

Introduction

Pulse Shock Isolation

Velocity Shock Isolation

Induced Stresses

Introduction

Forced Vibration

Random Vibration

Shock Environment

The Finite Element Methods

Introduction

Some Basic Definitions

The FEA Procedure
Finite Element Formulation

Formulation of Characteristic Matrix and Load Vector

Finite Element Formulation of Dynamic Problems

Finite Element Formulation of Heat Conduction

CAD to FEA Considerations
Criteria for Choosing Engineering Software

Summary

Mechanical and Thermomechanical Concerns
Introduction
General Stress–Strain Relationship

Determining Deformations under Application of General Loads

Thermal Strains and Stresses

Thermal Strains and Deflections

Simplifications (or Making Engineering Assumptions)

Acoustics
Introduction
Noise, Sound, and Their Difference
Governing Equations
Measurement and Standards
Acoustics as a Design Priority

Mechanical Failures and Reliability
Introduction
Failure Modes
Life Expectancy

Design Life, Reliability, and Failure Rate

Electrical Failures and Reliability

Introduction

Failure Modes and Mechanism

Life Expectancy of Electronics Assemblies

Design Life, Reliability, and Failure Rate

Chemical Attack Failures and Reliability Concerns

Introduction

Electrochemical Attacks

Migration and Electromigration

Reliability Models, Predictions, and Calculations

Introduction

Basic Definitions

Reliability Models

Device Failure Rate Prediction
System Failure Rate

Reliability Testing

Design Considerations in an Avionics Electronic Package

Introduction

Design Parameters
Analysis

Acknowledgment

Appendices

References

Über Autor(innen)

Ali Jamnia enjoys teaching and mentoring junior engineers. His primary expertise lies in electromechanical systems design and development. In addition, he enjoys conducting analysis of various engineering problems using numerical approximations and computer simulations. Dr. Jamnia has focused on the issues of electronics packaging since the early 1990s, and since 1995, has been involved with the development of innovative electronics systems to aid individuals with either physical or cognitive disabilities. In fact, his prime achievement has been the development of a specialized computer system called the Learning StationTM - used as a teaching tool for individuals with cognitive disabilities.