Liu / Salmela / Sarkka Reliability of Microtechnology

Interconnects, Devices and Systems
1. Auflage 2011
ISBN: 978-1-4419-5760-3
Verlag: Springer US
Format: PDF
Kopierschutz: 1 - PDF Watermark

E-Book, Englisch, 204 Seiten, eBook

Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.The book also includes exercises and detailed solutions at the end of each chapter.

Zielgruppe

Research

Autoren/Hrsg.

Liu, Johan

Salmela, Olli

Sarkka, Jussi

Morris, James E.

Tegehall, Per-Erik

Andersson, Cristina

Inhaltsverzeichnis

Introduction to Reliability and its Importance.- Reliability Metrology.- General Failure Mechanisms of Microsystems.- Solder and Conductive Adhesive Joint Reliability.- Accelerated Testing.- Reliability Design for Manufacturability.- Component Reliability.- System Level Reliability.- Reliability and Quality Management of Microsystem.- Experimental Tools for Reliability Analysis.