Bluetooth 5.0 Modem Design for IoT Devices

1. Auflage 2022
ISBN: 978-3-030-88628-8
Verlag: Springer International Publishing

Buch, Englisch, 111 Seiten, Format (B × H): 155 mm x 235 mm, Gewicht: 207 g

This book provides an introduction to Bluetooth technology, with a specific focus on developing a hardware architecture for its modem. The major concepts and techniques involved in Bluetooth technology are discussed, with special emphasis on hardware mapping. The book starts simply to allow the reader to master quickly the basic concepts, before addressing the advanced features.  This book differs from existing content in that it presents Bluetooth Transceiver architecture suitable for implementation in an FPGA for IoT Devices. It will examine several digital algorithms for modulation and demodulation of Bluetooth signals, locking on the carrier phase, and synchronizing the symbol. Many of these previously analog designs have been translated to the digital domain.  

Zielgruppe

Professional/practitioner

Autoren/Hrsg.

Mohamed, Khaled Salah

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Nachrichten- und Kommunikationstechnik
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise

Inhaltsverzeichnis

Introduction to Bluetooth.- GFSK Modem Design.- DPSK Modem Design.- Verification of the Bluetooth modem.- Conclusions.

Über Autor(innen)

Khaled Salah Mohamed attended the school of engineering, Department of Electronics and Communications at Ain-Shams University from 1998 to 2003, where he received his B.Sc. degree in Electronics and Communications Engineering with distinction and honors. He received his Masters degree in Electronics from Cairo University, Egypt in 2008. He received his PhD degree in 2012. Dr. Khaled Salah is currently an Applications Engineering Consultant for Siemens Digital Industries Software, in Freemont, CA. Dr. Khaled Salah has published a large number of papers in in the top refereed journals and conferences. His research interests are in 3D integration, IP Modeling, and SoC design.