Advanced Wirebond Interconnection Technology

2004. Auflage 2004
ISBN: 978-1-4020-7762-3
Verlag: Springer Us

Buch, Englisch, 669 Seiten, Buch mit CD-ROM, Format (B × H): 166 mm x 241 mm, Gewicht: 1192 g

Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way.

Zielgruppe

Research

Autoren/Hrsg.

Prasad, Shankara K

Fachgebiete

• Mathematik | Informatik EDV | Informatik Computerkommunikation & -vernetzung
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Elektronik, Optik
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik Werkzeugbau
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikroprozessoren
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Verbundwerkstoffe

Inhaltsverzeichnis

Materials for Wire Bonding.- Bonding Equipment.- Process Technology.- Quality.- Reliability.- New Technologies and New Applications for Wire Bonding.