AI in Food Packaging

Innovations for Safety, Sustainability, and Smart Solutions
1. Auflage 2026
ISBN: 978-1-041-24140-9
Verlag: Taylor & Francis Ltd

Buch, Englisch, 384 Seiten, Format (B × H): 178 mm x 254 mm

The traditional food packaging industry promises to be revolutionized by the integration of cutting-edge Artificial Intelligence (AI) technologies to enhance food safety, minimize environmental impact, and introduce intelligent packaging systems. AI in Food Packaging explores the transformative impact of artificial intelligence on the food packaging industry. It describes the cutting-edge technologies that enhance food safety, optimize sustainability, and enable smart packaging solutions. From intelligent labeling systems that monitor product freshness to AI-driven design innovations that minimize environmental impact, readers will discover practical applications and future trends shaping the industry. It combines insights from technology, science, and business to provide a comprehensive guide for professionals and enthusiasts alike.

Key Features:

- Analyzes cutting-edge AI technologies such as machine learning, IoT, and computer vision applied to food packaging systems

- Presents real-world case studies and industry applications demonstrating smart packaging for quality monitoring and traceability

- Covers sustainability-focused innovations including AI-driven material selection and eco-friendly packaging designs

- Provides insight into regulatory frameworks, safety standards, and ethical concerns related to AI in the food supply chain

Zielgruppe

Professional Practice & Development

Autoren/Hrsg.

Sarkar, Tanmay

Pandey, Jay Kumar

Fachgebiete

• Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Lebensmitteltechnologie und Getränketechnologie

Inhaltsverzeichnis

Introduction to AI in Food Packaging. AI For Ensuring Food Safety In Packaging. Smart Packaging Solutions: Sensors, IOT, and AI. Predictive Analytics for Shelf Life and Quality Assurance. Reducing Waste: AI In Packaging Lifecycle Management. Ethical And Regulatory Considerations in AI-Enhanced Packaging. AI and Augmented Reality (AR) in Interactive Packaging Experiences. Data Analytics in Consumer Feedback for Packaging Innovation. Future Perspectives: AI’s Role in Next-Generation Food Packaging. AI Driven Packaging Monitors the Freshness of Food (Temperature, Predict Spoilage. Material Optimization for the Food Packaging and Quality of Food. AI in Nutrient Preservation. Customization of Nutrient Content. AI In Supply Chain Optimization. AI Application in Food Packaging and Its Safety.

Über Autor(innen)

Dr. Tanmay Sarkar is currently working as a Lecturer in the Government of West Bengal. He has received his Bachelor of Technology, Master of Technology, and PhD in Engineering from Jadavpur University, Kolkata, India. With 9 years of experience in both teaching and research, his areas of interest include bioactive components from natural sources, ethnic foods, mathematical modeling, and phytochemicals. He is an editor for several SCI, SCIE, and Scopus-indexed journals and has edited 12 books with Elsevier, Springer, and Wiley. Dr. Sarkar has been classified among the top 2% of global highly-cited researchers published by Stanford University, USA. Dr. Jay Kumar Pandey is currently working as an Assistant Professor in the Department of Electrical & Electronics Engineering at Shri Ramswaroop Memorial University, Barabanki (U.P.) India.

Dr. Jay Kumar Pandey has completed his Ph.D. and has done his M.Tech. with specialization in Power Control (Instrumentation) and also done his MBA from Finance and Marketing. His subjects of interest are related to Artificial Intelligence ,Biomedical & Healthcare, Image Processing, Machine Learning and Renewable energy. He has 15 years of teaching and research experience has published more than 30 research papers in National and International journals /conferences & Book Chapters in CRC, NOVA, Taylor & Francis, Springer and IGI Publisher. Dr. Pandey is an editor of books (edited) published by reputed publishers Apple Academy Press, IGI, Elsevier, Wiley-IEEE, NOVA, Bentham Science ,IAP, Emerald Publication ,Taylor & Francis & Cambridge Scholar.Dr. Pandey is also Editor of Journal of Technology Innovations and Energy United States. Dr. Pandey having reviewer in different conference/Journal/Book Chapters like (The Journal of Supercomputing in Springer Nature, IGI publishing, Journal of Security and Communication Networks Hindawi, Journal of Biomimetics, Biomaterials and Biomedical Engineering (JBBBE) Scientific Net, Switzerland, Advanced Engineering Forum (AEF) Scientific Net, Switzerland)