Contactless VLSI Measurement and Testing Techniques

Softcover Nachdruck of the original 1. Auflage 2018
ISBN: 978-3-319-88819-4
Verlag: Springer International Publishing

Buch, Englisch, 93 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 184 g

This book provides readers with a comprehensive overview of the state-of-the-art in optical contactless probing approaches, in order to fill a gap in the literature on VLSI Testing.  The author highlights the inherent difficulties encountered with the mechanical probe and testability design approaches for functional and internal fault testing and shows how contactless testing might resolve many of the challenges associated with conventional mechanical wafer testing. The techniques described in this book address the increasing demands for internal access of the logic state of a node within a chip under test.

Zielgruppe

Research

Autoren/Hrsg.

Sayil, Selahattin

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikroprozessoren

Inhaltsverzeichnis

1. Conventional Test Methods. – 2. Testability Design.- 3. Other Techniques Based on the Contacting Probe.- 4. Contactless Testing.- 5. Electron-Beam and Photoemission Probing.- 6. Electro Optic Sampling and Charge Density Probe.- 7. Electric Force Microscope, Capacitive Coupling and Scanning Magneto-Resistive Probe.- 8. Probing Techniques Based on Light Emission from Chip.- 9. All Silicon Optical Technology for Contactless Testing of Integrated Circuits.- 10. Comparison of Contactless Testing Methodologies.

Über Autor(innen)

Dr. Selahattin Sayil is a Professor in the Philip M. Drayer Department of Electrical Engineering at Lamar University.  His research focuses on VLSI Testing,  Contactless Testing, Radiation effects modeling and hardening at the circuit level, Reliability analysis of low power designs, and Interconnect modeling and noise prediction.