Characterization and Metrology for ULSI Technology 2000

International Conference
1. Auflage 2001
ISBN: 978-1-56396-967-6
Verlag: AIP Press

Medienkombination, Englisch, Band 550, 708 Seiten, mit 1 CD-ROM, Gewicht: 1940 g

Reihe: AIP Conference Proceedings

The worldwide semiconductor community faces increasingly difficult challenges as it moves into the manufacturing of chips with feature sizes approaching 100 nm. Some of the challenges are materials-related, such as transistors with high-k dielectrics and on-chip interconnects made from copper and low-k dielectrics. The magnitude of these challenges demands special attention from those in the metrology and analytical measurements community. Characterization and metrology are key enablers for developing semiconductor process technology and in improving manufacturing.
This book summarizes major issues and gives critical reviews of important measurement techniques that are crucial to continue the advances in semiconductor technology. It covers major aspects of the process technology and most characterization techniques for silicon research, including development, manufacturing, and diagnostics.
It provides a concise and effective portrayal of industry characterization needs and some of the problems that must be addressed by industry, academia, and government to continue the dramatic progress in semiconductor technology. It also provides a basis for stimulating practical perspectives and new ideas for research and development.

Zielgruppe

Research

Autoren/Hrsg.

Seiler, David G.

Diebold, Alain C.

Shaffner, Thomas J.

McDonald, Robert

Bullis, W. Murray

Smith, Patrick J.

Secula, Erik M.

Fachgebiete

• Wirtschaftswissenschaften Betriebswirtschaft Bereichsspezifisches Management Produktionsmanagement, Qualitätskontrolle
• Naturwissenschaften Physik Thermodynamik Festkörperphysik, Kondensierte Materie
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Sensorik
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Halb- und Supraleitertechnologie
• Naturwissenschaften Physik Thermodynamik Oberflächen- und Grenzflächenphysik, Dünne Schichten
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Werkstoffkunde, Materialwissenschaft: Forschungsmethoden
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Elektronik, Optik
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise