E-Book, Englisch, 134 Seiten
Reihe: Springer Nature Proceedings excluding Computer Science
Shaw III / Prorok / Starman MEMS and Nanotechnology, Volume 5
1. Auflage 2013
ISBN: 978-3-319-00780-9
Verlag: Springer International Publishing
Format: PDF
Kopierschutz: 1 - PDF Watermark
Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics
E-Book, Englisch, 134 Seiten
Reihe: Springer Nature Proceedings excluding Computer Science
ISBN: 978-3-319-00780-9
Verlag: Springer International Publishing
Format: PDF
Kopierschutz: 1 - PDF Watermark
MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics , the fifth volume of eight from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including:
Microelectronics Packaging
Single Atom/Molecule Mechanical Testing
MEMS Devices & Fabrication
In-Situ Mechanical Testing
Nanoindentation
Experimental Analysis of Low-Dimensional Materials for Nanotechnology
Zielgruppe
Research
Autoren/Hrsg.
Weitere Infos & Material
From the Contents: Warpage Measurement of Simulated Electronic Packaging Assembly.- Nanomechanical Characterization of Lead Free Solder Joints.- In-Situ Surface Mount Process Characterization Using Digital Image Correlation.- Acoustic Waveform Energy as an Interconnect Damage Indicator.- Shape Optimization of Cantilevered Piezoelectric Devices.- Unique Fabrication Method for Novel MEMS Micro-contact Structure.- A Frequency Selective Surface Design Fabricated With Tunable RF Meta-atoms.- Stress Characterization in Si/SiO2 Spherical Shells Used in Micro-Robotics.
