Sherer Semiconductor Industry

Wafer Fab Exhaust Management
1. Auflage 2010
ISBN: 978-1-4200-2719-8
Verlag: Taylor & Francis
Format: PDF
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)

E-Book, Englisch, 216 Seiten

Given the myriad exhaust compounds and the corresponding problems that they can pose in an exhaust management system, the proper choice of such systems is a complex task. Presenting the fundamentals, technical details, and general solutions to real-world problems, Semiconductor Industry: Wafer Fab Exhaust Management offers practical guidance on selecting an appropriate system for a given application.

Using examples that provide a clear understanding of the concepts discussed, Sherer covers facility layout, support facilities operations, and semiconductor process equipment, followed by exhaust types and challenges. He reviews exhaust point-of-use devices and exhaust line requirements needed between process equipment and the centralized exhaust system. The book includes information on wet scrubbers for a centralized acid exhaust system and a centralized ammonia exhaust system and on centralized equipment to control volatile organic compounds. It concludes with a chapter devoted to emergency releases and a separate chapter of examples illustrating these systems in use.

Drawing on the author's 20 years of industry experience, the book shows you how to customize strategies specific to your needs, solve current problems, and prevent future issues in your exhaust management systems.

Zielgruppe

Semiconductor manufacturers, designers, and technicians, occupational health and safety managers, officials, and regulators, industrial engineers, environmental engineers and regulators, and anyone working with volatile or hazardous exhaust gases.

Autoren/Hrsg.

Sherer, J. Michael

Fachgebiete

• Technische Wissenschaften Technik Allgemein Technik: Allgemeines

Inhaltsverzeichnis

SEMICONDUCTOR AND WAFER MANUFACTURING FACILITIES
Wafer Fab Layout

Facility-Support Operations

Semiconductor Process Equipment

EXHAUST TYPES AND CHALLENGES

Exhaust Types

Exhaust Management Challenges

POINT-OF-USE DEVICES AND EXHAUST-LINE REQUIREMENTS
Point-Of-Use Device Information
Surrounding Exhaust-Line Requirements
Examples of Point-Of-Use Devices for Selected Processes

Fab Examples of Point-Of-Use Devices
Developing a Point-Of-Use Device and Surrounding Exhaust-Line Strategy
"Development Opportunities" for Point-Of-Use Devices

CENTRALIZED SCRUBBERS

Introduction

General Design and Operation

General Operation Information
Acid Scrubbers for Large Storage Tanks of Concentrated Acid Solution
Centralized Abatement Systems for Higher Inlet Concentrations of Acid Compounds, Chlorine, and Acid Mists

Centralized Scrubbing System for Oxides of Nitrogen

Specifying a Centralized Wet Scrubber

CENTRALIZED EQUIPMENT TO CONTROL VOLATILE ORGANIC COMPOUNDS
Introduction

Centralized Equipment Technologies to Control Volatile Organic Compounds
Examples of Selection Criteria for Centralized Equipment to Control Volatile Organic Compounds
Location of Fans

Testing of Centralized Equipment to Control Volatile Organic Compounds
Specification to Supplier of Centralized Equipment to Control Volatile Organic Compounds

EMERGENCY RELEASES
Introduction

Controlling Releases from Gas Cylinders or Other Vessels

Silane Emergency Release
Reduction of Emergency Release of Concentrations of Stack Discharge

EXHAUST MANAGEMENT AND AIR ABATEMENT EQUIPMENT EXAMPLES
List of Examples

Example No. 7-1
Example No. 7-2
Example No. 7-3
Example No. 7-4
Example No. 7-5

List of Acronyms