E-Book, Englisch, 378 Seiten
Subramanian Lead-Free Electronic Solders
1. Auflage 2007
ISBN: 978-0-387-48433-4
Verlag: Springer-Verlag
Format: PDF
Kopierschutz: Wasserzeichen (»Systemvoraussetzungen)
A Special Issue of the Journal of Materials Science: Materials in Electronics
E-Book, Englisch, 378 Seiten
ISBN: 978-0-387-48433-4
Verlag: Springer-Verlag
Format: PDF
Kopierschutz: Wasserzeichen (»Systemvoraussetzungen)
Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.
Autoren/Hrsg.
Weitere Infos & Material
1;Preface;7
2;Thermodynamics and phase diagrams of lead-free solder materials;9
3;Phase diagrams of Pb-free solders and their related materials systems;24
4;The effects of suppressed beta tin nucleation on the microstructural evolution of lead- free solder joints;43
5;Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications;59
6;Rare-earth additions to lead-free electronic solders;81
7;Compression stress–strain and creep properties of the 52In–48Sn and 97In– 3Ag low- temperature Pb- free solders;96
8;Sn–Zn low temperature solder;123
9;Composite lead-free electronic solders;130
10;Processing and material issues related to lead-free soldering;147
11;Interfacial reaction issues for lead-free electronic solders;155
12;Microstructure-based modeling of deformation in Sn-rich ( Pb- free) solder alloys;175
13;Deformation behavior of tin and some tin alloys;190
14;Mechanical fatigue of Sn-rich Pb-free solder alloys;210
15;Life expectancies of Pb-free SAC solder interconnects in electronic hardware;227
16;Assessment of factors influencing thermomechanical fatigue behavior of Sn- based solder joints under severe service environments;235
17;Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip- chip packages;245
18;Electromigration issues in lead-free solder joints;257
19;Stress analysis of spontaneous Sn whisker growth;267
20;Sn-whiskers: truths and myths;280
21;Tin pest issues in lead-free electronic solders;303
22;Issues related to the implementation of Pb-free electronic solders in consumer electronics;315
23;Impact of the ROHS directive on high-performance electronic systems;327
24;Impact of the ROHS Directive on high-performance electronic systems;343
