Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

1. Auflage 2024
ISBN: 978-0-367-63588-6
Verlag: CRC Press

Buch, Englisch, 406 Seiten, Format (B × H): 156 mm x 234 mm, Gewicht: 617 g

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.

- Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices

- Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data

- Covers how to design the most effective test vehicles for testing solder joints

- Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections

- Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases

- Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated tests

This book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design.

Zielgruppe

Academic

Autoren/Hrsg.

Suhir, Ephraim

Fachgebiete

• Naturwissenschaften Physik Elektromagnetismus
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik
• Technische Wissenschaften Technik Allgemein Technische Optik, Lasertechnologie
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Elektronik, Optik

Inhaltsverzeichnis

1. Analytical Modeling. 2. Method of Interfacial Compliance. 3. Thermal Stress in Assemblies with Identical Adherends. 4. Inelastic Strains. 5. Elevated Stand-Off Heights Can Relieve Thermal Stress in Solder Joints. 6. Stress Relief in Assemblies with Inhomogeneous Bonds. 7. Relieving Thermal Stress in Flip-Chip Design. 8. Board Level Dynamic Tests. 9. Accelerated Testing: HALT and FOAT. 10. Probabilistic Design for Reliability of Solder Joint Interconnections. 11. Thermal Stress in Optical Fibers