Tong / Lai / Wong Advanced Flip Chip Packaging
1. Auflage 2013
ISBN: 978-1-4419-5768-9
Verlag: Springer US
Format: PDF
Kopierschutz: 1 - PDF Watermark
E-Book, Englisch, 560 Seiten
Reihe: Engineering
ISBN: 978-1-4419-5768-9
Verlag: Springer US
Format: PDF
Kopierschutz: 1 - PDF Watermark
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Zielgruppe
Research
Autoren/Hrsg.
Weitere Infos & Material
Flip Chip Technology Overview and Early Beginnings.- Technology Trends of Flip Chip.- Bumping Technologies.- Flip-Chip Interconnections: Past, Present and Future.- Underfill.- Conductive Adhesives for Flip Chip Applications.- Enabling Substrate Technologies: Past, Present and Future.- IC-Package-System Integrated Design.- Thermal Management of Flip Chip Packages.- Thermo-Mechanical Reliability in Flip Chip Packages.- Interfacial Reactions and Electromigration in Flip-Chip Solder Joints.
