Wong Polymers for Electronic & Photonic Application

1. Auflage 2013
ISBN: 978-1-4832-8939-7
Verlag: Elsevier Science & Techn.
Format: PDF
Kopierschutz: 1 - PDF Watermark

E-Book, Englisch, 661 Seiten, Web PDF

The most recent advances in the use of polymeric materials by the electronic industry can be found in Polymers for Electronic and Photonic Applications. This bookprovides in-depth coverage of photoresis for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for multichip packaging,electronic and photonic applications of polymeric materials, among many other topics. Intended for engineers and scientists who design, process, and manufacturemicroelectronic components, this book will also prove useful for hybrid and systems packaging managers who want to be informed of the very latest developments inthis field.* Presents most recent advances in the use of polymeric materials by the electronic industry* Contributions by foremost experts in the field

Autoren/Hrsg.

Wong, C. P.

Inhaltsverzeichnis

1;Front Cover;1
2;Polymers for Electronic and Photonic Applications;4
3;Copyright Page;5
4;Table of Contents;6
5;Contributors;12
6;Preface;14
7;Chapter 1.
Overview of Polymers for Electronic and Photonic Applications;16
7.1;I. Introduction;16
7.2;II. Radiation-Sensitive Resists;20
7.3;III. Polymers for Packaging Applications;56
7.4;IV. Active Polymers;68
7.5;V. Conclusions;72
7.6;References;73
8;Chapter 2.
The Chemistry of Polymers for Microlithographic Applications;82
8.1;I. Introduction;82
8.2;II. Resist Design Requirements;86
8.3;III. Negative Resist Chemistry;90
8.4;IV. Positive Resist Chemistry;103
8.5;V. Multilevel Resist Chemistry;116
8.6;VI. Gas-Phase Functionalization;124
8.7;VII. Conclusion;125
8.8;References;126
9;Chapter 3.
Interconnect Dielectrics;134
9.1;I. Introduction;135
9.2;II. Chemistry of Candidate Interconnect Dielectrics;137
9.3;III. Polymer Processing;148
9.4;IV. Electrical Properties;161
9.5;V. Mechanical Properties;164
9.6;VI. Chemical Properties;170
9.7;VII. Conclusions;174
9.8;Acknowledgments;174
9.9;References;175
10;Chapter 4.
Recent Advances in IC Passivation and Encapsulation: Process Techniques and Materials;182
10.1;I. Introduction;182
10.2;II. Purpose of Encapsulation;184
10.3;III. Pre-encapsulation Cleaning;187
10.4;IV. Encapsulation Process Techniques;189
10.5;V. Device Encapsulants;201
10.6;VI. Recent Advances in Hermetically Equivalent IC Packaging;224
10.7;VII. Conclusions;228
10.8;References;229
11;Chapter 5.
Polyimides for Electronic Applications;236
11.1;I. Introduction;236
11.2;II. Classification of Electronic Applications;237
11.3;III. Advantages of Polyimide for Electronic Applications;237
11.4;IV. Varieties of Polyimide;237
11.5;V. Required Properties of Polyimide for Electronic Applications;241
11.6;VI. Conclusion;261
11.7;References;261
12;Chapter 6.
Polyimidesiloxanes: Chemistries and Applications;264
12.1;I. Introduction;264
12.2;II. Chemistry and Synthetic Schemes;266
12.3;III. Structure-Property Relationships — An Overview;288
12.4;IV. Products and Applications;289
12.5;V. New Developments and Remarks;295
12.6;Acknowledgments;297
12.7;References;298
13;Chapter 7.
Application of Epoxy Resins in Electronics;302
13.1;I. Introduction;302
13.2;II. Epoxy Resins;303
13.3;III. Curing Agents;307
13.4;IV. Summary;344
13.5;References;345
14;Chapter 8.
Advances in Thermoplastics For Electronic Applications;348
14.1;I. Introduction;348
14.2;II. A Brief History of Plastics in Electronics;349
14.3;III. Emerging Trends in Electronics and Their Impact on Plastics;350
14.4;IV. Application Criteria for Plastics in Electronics;352
14.5;V. New Thermoplastics and Their Properties;354
14.6;VI. Emerging Electronic Applications of Thermoplastics;378
14.7;VII. Future Trends and Needs;395
14.8;References;399
15;Chapter 9.
Polymers for Increased Circuit Density in Interconnection Technology;402
15.1;I. Introduction;402
15.2;II. Multilayer Dielectrics;403
15.3;III. Material Design Strategy;408
15.4;IV. Structure Evaluation;440
15.5;V. Strategy Summary;442
15.6;References;447
16;Chapter 10.
Piezoelectric and Pyroelectric Polymers;450
16.1;I. Introduction;450
16.2;II. Polarization in Polymers;452
16.3;III. Pyroelectric Coefficients;461
16.4;IV. Piezoelectric Coefficients;465
16.5;V. Specific Polymers;469
16.6;VI. Conclusion;475
16.7;References;476
17;Chapter 11. Polymers for Nonlinear Optics;482
17.1;I. Introduction;482
17.2;II. Applications Requirements;488
17.3;III. Polymers for x(2) Applications;498
17.4;IV. Organic Materials for Third-Order Nonlinear Applications;509
17.5;V. Conclusions;514
17.6;References;516
18;Chapter 12.
Polymers as Third-Order Nonlinear-Optical Materials;522
18.1;I. Introduction;522
18.2;II. Nonlinear Optics — Theory;526
18.3;III. Measuring Microscopic Elasticities with Second Harmonic Generation;540
18.4;IV. Molecular Susceptibilities;542
18.5;V. Experimental Techniques;551
18.6;VI. Electronic Response of a Disperse Red Azo Dye;555
18.7;VII. Survey of Molecular Susceptibilities;557
18.8;VIII. Future of Doped Polymers as Third-Order Materials;560
18.9;Acknowledgments;561
18.10;Appendix A;562
18.11;References;562
19;Chapter 13.
Polymers for Integrated Optical Waveguides;564
19.1;I. Introduction;564
19.2;II. Polymer Integrated Optics for Optical Interconnects;565
19.3;III. Waveguide Fabrication Technique Review;566
19.4;IV. Polymers for Optical Interconnects;608
19.5;Acknowledgments;609
19.6;References;612
20;Chapter 14.
Langmuir-Blodgett Manipulation of Electrically Responsive Polymers;616
20.1;I. Introduction;616
20.2;II. Langmuir-Blodgett Multilayers: Fabrication and Characterization;617
20.3;III. Design, Fabrication, and Properties of Electrically Conductive LB Films;631
20.4;IV. Complex Molecular Assemblies of Electroactive Polymers;637
20.5;Acknowledgments;642
20.6;References;642
21;Chapter 15.
Basic Concepts of Polymer Mechanical Behavior;648
21.1;I. Introduction;648
21.2;II. Concepts of Elasticity;649
21.3;III. The Concepts of Viscoelasticity;651
21.4;IV. Measurement of Viscoelastic Behavior;652
21.5;V. The Effect of Temperature and Time -Temperature Superposition;654
21.6;VI. Large Deformation Behavior;662
21.7;References;665
22;Index;666