Zhou / En / Chen Reliability Technology for Integrated Circuit Packaging
Erscheinungsjahr 2026
ISBN: 978-981-953885-0
Verlag: Springer Singapore
Format: PDF
Kopierschutz: 1 - PDF Watermark
E-Book, Englisch, 510 Seiten
Reihe: Engineering
ISBN: 978-981-953885-0
Verlag: Springer Singapore
Format: PDF
Kopierschutz: 1 - PDF Watermark
This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.
Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.
Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.
Zielgruppe
Research
Autoren/Hrsg.
Weitere Infos & Material
Overview of Integrated Circuit Packaging Technology and Reliability.- Physical Properties and Reliability Characteristics of Integrated Circuit Packaging.- Failure Modes, Mechanisms, and Reliability of Plastic Packaging.- Failure Modes, Failure Mechanism and Reliability of Hermetic Packaging.- Failure Modes, Mechanisms, and Reliability of 3D Packaging.- Thermal Performance and Analysis Techniques of Integrated Circuit Packaging.- Mechanical Characteristics and Tests of Integrated Circuit Packaging.- Failure Analysis Techniques for Integrated Circuit Packaging.- Quality and Reliability Assurance in Integrated Circuit Packaging- Reliability of Integrated Circuit Board-level Assembly.
