Buch, Englisch, 271 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 446 g
Buch, Englisch, 271 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 446 g
ISBN: 978-1-4419-1956-4
Verlag: Springer
The main objective of this book is to cover the basic understanding of thermal conduction mechanisms in various high thermal conductivity materials including diamond, cubic boron nitride, and also the latest material like carbon nanotubes.
The book is intended as a good reference book for scientists and engineers involved in addressing thermal management issues in a broad spectrum of industries.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Technik Allgemein Physik, Chemie für Ingenieure
- Naturwissenschaften Physik Physik Allgemein Experimentalphysik
- Naturwissenschaften Physik Thermodynamik Festkörperphysik, Kondensierte Materie
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Werkstoffkunde, Materialwissenschaft: Forschungsmethoden
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Technische Thermodynamik
Weitere Infos & Material
Lattice Thermal Conduction Mechanism in Solids.- High Lattice Thermal Conductivity Solids.- Thermal Characterization of the High-Thermal-Conductivity Dielectrics.- Thermal Wave Probing of High-Conductivity Heterogeneous Materials.- Fabrication of High-Thermal-Conductivity Polycrystalline Aluminum Nitride: Thermodynamic and Kinetic Aspects of Oxygen Removal.- High-Thermal-Conductivity SiC and Applications.- Chemical-Vapor-Deposited Diamond for High-Heat-Transfer Applications.- Unusually High Thermal Conductivity in Carbon Nanotubes.
