Sazonov | Wearable Sensors | E-Book | sack.de
E-Book

E-Book, Englisch, 656 Seiten

Sazonov Wearable Sensors

Fundamentals, Implementation and Applications
1. Auflage 2014
ISBN: 978-0-12-418666-8
Verlag: Elsevier Science & Techn.
Format: EPUB
Kopierschutz: 6 - ePub Watermark

Fundamentals, Implementation and Applications

E-Book, Englisch, 656 Seiten

ISBN: 978-0-12-418666-8
Verlag: Elsevier Science & Techn.
Format: EPUB
Kopierschutz: 6 - ePub Watermark



Written by industry experts, this book aims to provide you with an understanding of how to design and work with wearable sensors. Together these insights provide the first single source of information on wearable sensors that would be a valuable addition to the library of any engineer interested in this field.Wearable Sensors covers a wide variety of topics associated with the development and application of various wearable sensors. It also provides an overview and coherent summary of many aspects of current wearable sensor technology.Both industry professionals and academic researchers will benefit from this comprehensive reference which contains the most up-to-date information on the advancement of lightweight hardware, energy harvesting, signal processing, and wireless communications and networks. Practical problems with smart fabrics, biomonitoring and health informatics are all addressed, plus end user centric design, ethical and safety issues. - Provides the first comprehensive resource of all currently used wearable devices in an accessible and structured manner - Helps engineers manufacture wearable devices with information on current technologies, with a focus on end user needs and recycling requirements - Combines the expertise of professionals and academics in one practical and applied source

Sazonov Wearable Sensors jetzt bestellen!

Autoren/Hrsg.


Weitere Infos & Material


List of Contributors
Ruzena Bajcsy,     Electrical Engineering and Computer Science, University of California, Berkeley, California, USA Paolo Barsocchi,     ISTI-CNR, Pisa, Italy Fernando Benito-Lopez CIC microGUNE, Arrasate-Mondragón, Spain INSIGHT: Centre for Data Analytics, National Centre for Sensor Research, Dublin City University, Dublin, Ireland Mattia Bertschi,     Tampere University of Technology, Tampere, Finland Laura Caldani,     Smartex s.r.l., Pisa, Italy Alexander J. Casson,     Imperial College, London, UK Gert Cauwenberghs,     Department of Bioengineering at University of California, San Diego, La Jolla, CA, USA Guangwei Chen,     Imperial College, London, UK Yu M. Chi,     Cognionics, Inc., San Diego, CA, USA Kyunghee Chung,     Georgia Institute of Technology, School of Materials Science & Engineering, Atlanta, Georgia, USA Shirley Coyle,     INSIGHT: Centre for Data Analytics, National Centre for Sensor Research, Dublin City University, Dublin, Ireland Vincenzo F. Curto,     INSIGHT: Centre for Data Analytics, National Centre for Sensor Research, Dublin City University, Dublin, Ireland Dermot Diamond,     INSIGHT: Centre for Data Analytics, National Centre for Sensor Research, Dublin City University, Dublin, Ireland Xiaorong Ding,     Department of Electronic Engineering, The Chinese University of Hong Kong, Hong Kong SAR, China Tobias Dräger,     Fraunhofer Institute for Integrated Circuits IIS, Nuremberg, Germany Lucy Dunne,     University of Minnesota, Minneapolis, MN, USA John Dykstra,     MetaLogics Inc., Minneapolis, Minnesota, USA Larisa Florea,     INSIGHT: Centre for Data Analytics, National Centre for Sensor Research, Dublin City University, Dublin, Ireland Juan M. Fontana,     The University of Alabama, Tuscaloosa, Alabama, USA Maysam Ghovanloo,     GT-Bionics Lab, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia, USA Sohmyung Ha,     Department of Bioengineering at University of California, San Diego, La Jolla, CA, USA Xueliang Huo,     Interactive Entertainment Business, Microsoft, Redmond, Washington, USA Jung-Hwan Hwang,     Electronics and Telecommunications Research, Daejeon, Korea Chang-Hee Hyoung,     Electronics and Telecommunications Research, Daejeon, Korea Roozbeh Jafari,     University of Texas at Dallas, Richardson, Texas, USA Sundaresan Jayaraman,     Georgia Institute of Technology, School of Materials Science & Engineering, Atlanta, Georgia, USA Chul Kim,     Department of Bioengineering at University of California, San Diego, La Jolla, CA, USA Ilkka Korhonen,     Tampere University of Technology, Tampere, Finland Yuichi Kurita,     Institute of Engineering, Hiroshima University, Hiroshima, Japan Tomohiro Kuroda,     Kyoto University Hospital, Kyoto, Japan Mathieu Lemay,     Tampere University of Technology, Tampere, Finland Ming Li,     Utah State University, Logan, Utah, USA Vitali Loseu,     MPI Lab, Samsung Research America Ningqi Luo,     Department of Electronic Engineering, The Chinese University of Hong Kong, Hong Kong SAR, China I. Maglogiannis,     Department of Digital Systems, University of Piraeus, Piraeus, Greece Masaaki Makikawa,     Ritsumeikan University, Kyoto, Japan A.L.R. Mansano,     Delft University of Technology, Delft, The Netherlands Atsuji Masuda,     Industrial Technology Center of Fukui Prefecture, Fukui, Japan Loreto Mateu,     Fraunhofer Institute for Integrated Circuits IIS, Nuremberg, Germany Iker Mayordomo,     Fraunhofer Institute for Integrated Circuits IIS, Nuremberg, Germany Ed Melanson,     University of Colorado Anschutz Medical Campus, Denver, Colorado, USA Shima Okada,     Kinki University, Osaka, Japan Maria Pacelli,     Smartex s.r.l., Pisa, Italy Rita Paradiso,     Smartex s.r.l., Pisa, Italy Jakub Parak,     Tampere University of Technology, Tampere, Finland Sungmee Park,     Georgia Institute of Technology, School of Materials Science & Engineering, Atlanta, Georgia, USA Markus Pollak,     Fraunhofer Institute for Integrated Circuits IIS, Nuremberg, Germany Carmen C.Y. Poon,     Department of Electronic Engineering and Department of Surgery, The Chinese University of Hong Kong, Hong Kong SAR, China Francesco Potortì,     ISTI-CNR, Pisa, Italy Halley Profita,     University of Minnesota, Minneapolis, MN, USA Philippe Renevey,     Tampere University of Technology, Tampere, Finland Esther Rodriguez-Villegas,     Imperial College, London, UK Giovanni Salvatore,     ETH Zürich, Zürich, Switzerland H.G. Sandalidis,     Department of Computer Science and Biomedical Informatics, University of Thessaly, Lamia, Greece Edward Sazonov,     The University of Alabama, Tuscaloosa, Alabama, USA W.A. Serdijn,     Delft University of Technology, Delft, The Netherlands Edmund Seto,     School of Public Health, University of Washington, Seattle, Washington, USA Lu Shi,     University of Arkansas at Little Rock, Little Rock, Arkansas, USA Naruhiro Shiozawa,     Ritsumeikan University, Kyoto, Japan Josep Sola,     Tampere University of Technology, Tampere, Finland M. Stoopman,     Delft University of Technology, Delft, The Netherlands Neil Szuminsky,     MetaLogics Inc., Minneapolis, Minnesota, USA Hideya Takahashi,     Osaka City University, Osaka, Japan Toshiyo Tamura,     Osaka Electro-Communication University, Neyagawa, Japan Gerhard Tröster,     ETH Zürich, Zürich, Switzerland Jian Wu,     University of Texas at Dallas, Richardson, Texas, USA Shucheng Yu,     University of Arkansas at Little Rock, Little Rock, Arkansas, USA Clint...



Ihre Fragen, Wünsche oder Anmerkungen
Vorname*
Nachname*
Ihre E-Mail-Adresse*
Kundennr.
Ihre Nachricht*
Lediglich mit * gekennzeichnete Felder sind Pflichtfelder.
Wenn Sie die im Kontaktformular eingegebenen Daten durch Klick auf den nachfolgenden Button übersenden, erklären Sie sich damit einverstanden, dass wir Ihr Angaben für die Beantwortung Ihrer Anfrage verwenden. Selbstverständlich werden Ihre Daten vertraulich behandelt und nicht an Dritte weitergegeben. Sie können der Verwendung Ihrer Daten jederzeit widersprechen. Das Datenhandling bei Sack Fachmedien erklären wir Ihnen in unserer Datenschutzerklärung.