Bath Lead-Free Soldering

1. Auflage 2007
ISBN: 978-0-387-68422-2
Verlag: Springer
Format: PDF
Kopierschutz: 1 - PDF Watermark

E-Book, Englisch, 299 Seiten

The worldwide trend toward lead-free components and soldering is especially urgent in the European Union with the implementation strict new standards in July 2006, and with pending implementation of laws in China and California. This book provides a standard reference guide for engineers who must meet the new regulations, including a broad collection of techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources.

Autoren/Hrsg.

Bath, Jasbir

Inhaltsverzeichnis

1;Preface;5
2;Table of Contents;6
3;Chapter 1: Lead Restrictions and Other Regulatory Influences on the Electronics Industry;17
3.1;1.1 Introduction;17
3.2;1.2 A Regulatory Tour of Europe;18
3.3;1.3 A Regulatory Tour of Asia;26
3.4;1.4 A Regulatory Tour of the Americas;28
3.5;1.5 Business Impacts and Conclusions;29
3.6;Conclusions;30
4;Chapter 2: Fundamental Properties of Pb-Free Solder Alloys;32
4.1;2.1 Search for a Pb-Free Alternative to Sn-Pb Eutectic;32
4.2;2.2 Primary Alloy Design Criteria;32
4.3;2.3 Solder Alloy Solidification and Microstructural Development;36
4.4;2.4 Melting Behavior;36
4.5;2.5 Solidification Behavior;55
4.6;2.7 Pb-Free Solder Mechanical Behavior and Solder Joint Reliability;73
4.7;Future Work;80
4.8;Acknowledgements;81
4.9;References;81
5;Chapter 3: Lead-Free Surface Mount Assembly;86
5.1;3.1 Introduction;86
5.2;3.2 Solder Paste Alloy;86
5.3;3.3 Screen Printing Process;87
5.4;3.4 Component Placement;88
5.5;3.5 Reflow Soldering;89
5.6;3.6 Solder Joint Inspection and Acceptance Criteria;93
5.7;References;101
5.8;Summary;101
6;Chapter 4: Lead-Free Wave Soldering;102
6.1;4.1 Introduction;102
6.2;4.2 Lead-Free Wave Solder Alloy Alternatives;103
6.3;4.3 Wave Solder Equipment Recommendations;105
6.4;4.4 Process Recommendations;109
6.5;4.5 Solder Joint Characterization;113
6.6;4.6 Design Considerations;121
6.7;Conclusions;125
6.8;Acknowledgements;126
6.9;References;126
7;Chapter 5: Lead-Free Rework;128
7.1;5.1 Introduction;128
7.2;5.2 Lead-Free Hand Soldering SMT Rework;128
7.3;5.3 Lead-Free SMT Rework of BGA/CSP Soldered Joints;135
7.4;5.4 Lead-Free Pin-Through-Hole (PTH) Hand Solder Rework;146
7.5;5.5 Lead-Free Pin-Through-Hole Mini-Pot Rework Soldering;149
7.6;Acknowledgments;153
7.7;References;153
8;Chapter 6: Lead-Free Solder Joint Reliability;155
8.1;6.1 Introduction;155
8.2;6.2 General Trends;156
8.3;6.3 SAC Solder Joint Reliability Case Study;163
8.4;Conclusions;180
8.5;References;181
8.6;Acknowledgements;181
9;Chapter 7: Backward and Forward Compatibility;183
9.1;7.1 Introduction;183
9.2;7.2 Reliability of BGA/CSP Backward Compatibility;187
9.3;7.3 Estimation of Mixed Composition Liquidus Temperature;192
9.4;7.4 Chip Component and Lead- Frame Component Backward Compatibility;197
9.5;7.5 Forward Compatibility;200
9.6;7.6 Press Fit Connector Interconnections;202
9.7;Summary;203
9.8;Acknowledgements;204
9.9;References;204
10;Chapter 8: PCB Laminates;208
10.1;8.1 Introduction;208
10.2;8.2 Types of Stress in Printed Wiring Boards;209
10.3;8.3 Laminate Material Test Methods;211
10.4;8.4 Accelerated Thermal Stress Testing;215
10.5;8.5 Accelerated Thermal Stress Test Methods;218
10.6;8.6 HATS Test Method – A Case Study;221
10.7;Conclusions;227
10.8;References;228
10.9;Future Work;228
10.10;Acknowledgements;228
11;Chapter 9: Lead-Free Board Surface Finishes;230
11.1;9.1 Introduction;230
11.2;9.2 Process Overview;231
11.3;Summary;270
11.4;Acknowledgements;276
11.5;References;276
12;Chapter 10: Lead-Free Soldering Standards;279
12.1;10.1 Introduction;279
12.2;10.2 IPC and JEDEC Standards;279
12.3;10.3 IEC Standards;287
12.4;10.4 Japan (JEITA) Standards;288
12.5;10.5 Other Standards;289
12.6;Conclusions;289
12.7;References;290
12.8;Future Work;290
13;Conclusions;293
14;Index;299