Buch, Englisch, 107 Seiten, Hardback, Format (B × H): 178 mm x 254 mm, Gewicht: 408 g
Reihe: IOP Concise Physics
Buch, Englisch, 107 Seiten, Hardback, Format (B × H): 178 mm x 254 mm, Gewicht: 408 g
Reihe: IOP Concise Physics
ISBN: 978-1-64327-808-7
Verlag: Morgan & Claypool Publishers LLC-Iop
It is generally acknowledged that modeling and simulation are preferred alternatives to trial and error approaches to semiconductor fabrication in the present environment, where the cost of process runs and associated mask sets is increasing exponentially with successive technology nodes. Hence, accurate physical device simulation tools are essential to accurately predict device and circuit performance.Accurate thermal modelling and the design of microelectronic devices and thin film structures at the micro- and nanoscales poses a challenge to electrical engineers who are less familiar with the basic concepts and ideas in sub-continuum heat transport. This book aims to bridge that gap. Efficient heat removal methods are necessary to increase device performance and device reliability. The authors provide readers with a combination of nanoscale experimental techniques and accurate modelling methods that must be employed in order to determine a device's temperature profile.
Autoren/Hrsg.
Weitere Infos & Material
- 1. Introduction
- 2. Current state of the art in modeling heating effects in nanoscale devices.
- 3. Phonon Monte Carlo simulation
- 4. Summary
