Buch, Englisch, 760 Seiten, Format (B × H): 149 mm x 228 mm, Gewicht: 1236 g
Buch, Englisch, 760 Seiten, Format (B × H): 149 mm x 228 mm, Gewicht: 1236 g
ISBN: 978-0-323-51084-4
Verlag: Elsevier Science & Technology
The book helps the reader understand the process they are using for their cleaning application and why the selected process works. For example, discussion of the mechanism and physics of contamination, metal, particle and organic includes information on particle removal, metal passivation, hydrogen-terminated silicon and other processes that engineers experience in their working environment. In addition, the handbook assists the reader in understanding analytical methods for evaluating contamination.
The book is arranged in an order that segments the various cleaning techniques, aqueous and dry processing. Sections include theory, chemistry and physics first, then go into detail for the various methods of cleaning, specifically particle removal and metal removal, amongst others.
Zielgruppe
<p>Managers, engineers, and technicians that manufacture integrated circuits or supply the semiconductor and microelectronics industries</p>
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
Part 1: Introduction and Overview 1. Overview and Evolution of Silicon Wafer Cleaning Technology 2. Overview of Wafer Contamination and Defectivity
Part 2: Wet-Chemical Processes 3. Particle Deposition and Adhesion 4. Aqueous Cleaning and Surface Conditioning Processes
Part 3: Dry Cleaning Processes 5. Gas-phase Wafer Cleaning Technology 6. Plasma Stripping and Cleaning 7. Cryogenic Aerosols and Supercritical Fluid Cleaning
Part 4: Analytical and Control Aspects 8. Detection and Measurement of Particulate Contaminants 9. Surface Chemical Composition and Morphology 10. Ultratrace Impurity and Surface Morphology Analysis