Thermal Testing of Integrated Circuits

1. Auflage. Softcover version of original hardcover Auflage 2002
ISBN: 978-1-4419-5287-5
Verlag: Springer US

Buch, Englisch, 204 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 347 g

Temperature has been always considered as an appreciable magnitude to detect failures in electric systems. In this book, the authors present the feasibility of considering temperature as an observable for testing purposes, with full coverage of the state of the art.

Zielgruppe

Research

Autoren/Hrsg.

Rubio, Antonio

Altet, J.

Fachgebiete

• Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik Werkzeugbau
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikroprozessoren

Inhaltsverzeichnis

1. Introduction to the Testing of Integrated Circuits.- 2. Thermal Transfer and Thermal Coupling in IC’s.- 3. Thermal Analysis in Integrated Circuits.- 4. Temperature as a Test Observable Variable in ICS.- 5. Thermal Monitoring of IC’s.- 6. Feasibility Analysis and Conclusions.