Seshan | Handbook of Thin Film Deposition Techniques Principles, Methods, Equipment and Applications, Second Editon | Buch | 978-0-8155-1442-8 | www.sack.de

Buch, Englisch, 658 Seiten, Format (B × H): 158 mm x 231 mm, Gewicht: 1148 g

Seshan

Handbook of Thin Film Deposition Techniques Principles, Methods, Equipment and Applications, Second Editon


2. Auflage 2002
ISBN: 978-0-8155-1442-8
Verlag: CRC Press

Buch, Englisch, 658 Seiten, Format (B × H): 158 mm x 231 mm, Gewicht: 1148 g

ISBN: 978-0-8155-1442-8
Verlag: CRC Press

The Handbook of Thin Film Deposition Techniques: Principles, Methods, Equipment and Applications, Second Edition explores the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition.

This second edition explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of submicron dimensions. The book covers PVD, laser and E-beam assisted deposition, MBE, and ion beam methods to bring together all of the physical vapor deposition techniques. The book also includes coverage of chemical mechanical polishing that helps attain the flatness that is required by modern lithography methods and new materials used for interconnect dielectric materials, specifically organic polyimide materials.

Seshan Handbook of Thin Film Deposition Techniques Principles, Methods, Equipment and Applications, Second Editon jetzt bestellen!

Zielgruppe

New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries.

Autoren/Hrsg.

Seshan, Krishna

Fachgebiete

Weitere Infos & Material

Recent Changes in the Semiconductor Industry. 1 Deposition Technologies and Applications: Introduction and Overview. 2 Silicon Epitaxy by Chemical Vapor Deposition. 3 Chemical Vapor Deposition of Silicon Dioxide Films. 4 Metal Organic Chemical Vapor Deposition: Technology and Equipment. 5 Feature Scale Modeling. 6 The Role of Metrology and Inspection In Semiconductor Processing. 7 Contamination Control, Defect Detection, and Yield Enhancement in Gigabit Manufacturing. 8 Sputtering and Sputter Deposition. 9 Laser and Electron Beam Assisted Processing. 10 Molecular Beam Epitaxy: Equipment and Practice. 11 Ion Beam Deposition. 12 Chemical Mechanical Polishing. 13 Organic Dielectrics in Multilevel Metalization of Integrated Circuits. 14 Performance, Processing, and Lithography Trends. Index

Krishna Seshan

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