Subramanian Lead-free Solders

Materials Reliability for Electronics
1. Auflage 2012
ISBN: 978-1-119-96621-0
Verlag: John Wiley & Sons
Format: PDF
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)

E-Book, Englisch, 528 Seiten, E-Book

Reihe: Wiley Series in Materials for Electronic & Optoelectronic Applications

Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers:
* Phase diagrams and alloy development
* Effect of minor alloying additions
* Composite approaches including nanoscale reinforcements
* Mechanical issues affecting reliability
* Reliability under impact loading
* Thermomechanical fatigue
* Chemical issues affecting reliability
* Whisker growth
* Electromigration
* Thermomigration
Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.

Autoren/Hrsg.

Subramanian, K.

Über Autor(innen)

K. N. Subramanian is Professor of Materials Science and Engineering at Michigan State University. He has been a full-time faculty member at MSU for over 45 years. For the last 15 years he has devoted all his research efforts to lead-free electronic solders.