VLSI Technology

1. Auflage 2003
ISBN: 978-0-8493-1738-5
Verlag: CRC Press

Buch, Englisch, 398 Seiten, Format (B × H): 183 mm x 260 mm, Gewicht: 945 g

As their name implies, VLSI systems involve the integration of various component systems. While all of these components systems are rooted in semiconductor manufacturing, they involve a broad range of technologies. This volume of the Principles and Applications of Engineering series examines the technologies associated with VLSI systems, including VLSI processes, semiconductor technology, micromachining, microelectronics packaging, compound semiconductor digital ICs, and multichip modules. Highlights include discussions on relatively recent innovations and progress in areas such as SiGE, SiC, and SOI technologies, noise issues, materials, and logic design.

Zielgruppe

Professional

Autoren/Hrsg.

Chen, Wai-Kai

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise

Inhaltsverzeichnis

VLSI Technology: A System Perspective. CMOS/BiCMOS Technology. Bipolar Technology. Silicon on Insulator Technology. SiGe Technology. SiC Technology. Passive Components. Power IC Technologies. Noise in VLSI Technologies. Micromachining. Microelectronics Packaging. Multichip Module Technologies. Channel Hot Electron Degradation-Delay in MOS Transistors Due to Deuterium Anneal. Materials. Compound Semiconductor Devices for Digital Circuits. Logic Design Principles and Examples. Logic

As their name implies, VLSI systems involve the integration of various component systems. While all of these components systems are rooted in semiconductor manufacturing, they involve a broad range of technologies. This volume of the Principles and Applications of Engineering series examines the technologies associated with VLSI systems, including VLSI processes, semiconductor technology, micromachining, microelectronics packaging, compound semiconductor digital ICs, and multichip modules. Highlights include discussions on relatively recent innovations and progress in areas such as SiGE, SiC, and SOI technologies, noise issues, materials, and logic design.

Über Autor(innen)

Wai-Kai Chen