Cyber-Physical and Gentelligent Systems in Manufacturing and Life Cycle

Genetics and Intelligence - Keys to Industry 4.0
Erscheinungsjahr 2017
ISBN: 978-0-12-811939-6
Verlag: Elsevier Science

Buch, Englisch, 492 Seiten, Format (B × H): 151 mm x 228 mm, Gewicht: 798 g

Cyber-Physical and Gentelligent Systems in Manufacturing and Life Cycle explores the latest technologies resulting from the integration of sensing components throughout the production supply chain, and the resulting possibilities to improve efficiency, flexibility, and product quality. The authors present cutting edge research into data storage in components, communication devices, data acquisition, as well as new industrial applications.

Detailed technical descriptions of the tools are presented in addition to discussions of how these systems have been used, the benefits they provide, and what industry problems they could tackle in the future. This is essential reading for researchers and production engineers interested in the potential of cyber physical systems to optimize all parts of the supply chain.

Zielgruppe

<p>Researchers and graduate students of production engineering, intelligent manufacturing systems, and control engineering. </p>

Autoren/Hrsg.

Denkena, Berend

Morke, Tobias

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Nachrichten- und Kommunikationstechnik Regelungstechnik
• Technische Wissenschaften Technik Allgemein Mess- und Automatisierungstechnik
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik

Inhaltsverzeichnis

1. Introduction 2. Sensors, Data Storage, and Communication Technologies 3. Applications in Manufacturing 4. Applications in the Product Life Cycle 5. Examples of Application

Über Autor(innen)

Morke, Tobias
Manager of collaborative research centre 653, at the Institute of Production Engineering and Machine Tools at Leibniz University, Hannover, Germany. The focus of CRC 653 is on the integration of components with their corresponding information for reproduction as well as corresponding stress information from their lifecycle.