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Eingebettete Systeme
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Metzler / Gaillardon / Reis VLSI-SoC: New Technology Enabler
27th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2019, Cusco, Peru, October 6-9, 2019, Revised and Extended Selected Papers1. Auflage 2020Verlag: Springer International PublishingISBN: 978-3-030-53275-8Medium: Buch53,49 € (inkl. MwSt.)
Lieferzeit ca. 10 Werktage
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Metzler / Gaillardon / Reis VLSI-SoC: New Technology Enabler
27th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2019, Cusco, Peru, October 6-9, 2019, Revised and Extended Selected Papers1. Auflage 2020Verlag: Springer International PublishingISBN: 978-3-030-53272-7Medium: Buch53,49 € (inkl. MwSt.)
Lieferzeit ca. 10 Werktage
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Ayala / Reis / Atienza Alonso VLSI-SoC: Forward-Looking Trends in IC and Systems Design
18th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2010, Madrid, Spain, September 27-29, 2010, Revised Selected Papers2012Verlag: SpringerISBN: 978-3-642-28565-3Medium: Buch53,49 € (inkl. MwSt.)
Lieferzeit ca. 10 Werktage
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Ayala / Reis / Atienza Alonso VLSI-SoC: Forward-Looking Trends in IC and Systems Design
18th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2010, Madrid, Spain, September 27-29, 2010, Revised Selected Papers2012Verlag: SpringerISBN: 978-3-642-44175-2Medium: Buch53,49 € (inkl. MwSt.)
Lieferzeit ca. 10 Werktage
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Schirner / Götz / Rammig Embedded Systems: Design, Analysis and Verification
4th IFIP TC 10 International Embedded Systems Symposium, IESS 2013, Paderborn, Germany, June 17-19, 2013, ProceedingsSoftcover Nachdruck of the original 1. Auflage 2013Verlag: SpringerISBN: 978-3-642-43028-2Medium: Buch53,49 € (inkl. MwSt.)
Lieferzeit ca. 10 Werktage
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Schirner / Götz / Rammig Embedded Systems: Design, Analysis and Verification
4th IFIP TC 10 International Embedded Systems Symposium, IESS 2013, Paderborn, Germany, June 17-19, 2013, Proceedings2013Verlag: SpringerISBN: 978-3-642-38852-1Medium: Buch53,49 € (inkl. MwSt.)
Lieferzeit ca. 10 Werktage
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Rettberg / Zanella / Rammig Analysis, Architectures and Modelling of Embedded Systems
Third IFIP TC 10 International Embedded Systems Symposium, IESS 2009, Langenargen, Germany, September 14-16, 2009, Proceedings2009Verlag: SpringerISBN: 978-3-642-04283-6Medium: Buch106,99 € (inkl. MwSt.)
Lieferzeit ca. 10 Werktage
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Rettberg / Zanella / Rammig Embedded System Design: Topics, Techniques and Trends
IFIP TC10 Working Conference: International Embedded Systems Symposium (IESS), May 30 - June 1, 2007, Irvine (CA), USA1. Auflage. Softcover version of original hardcover Auflage 2007Verlag: Springer USISBN: 978-1-4419-4429-0Medium: Buch106,99 € (inkl. MwSt.)
Lieferzeit ca. 10 Werktage
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Rettberg / Zanella / Domer Embedded System Design: Topics, Techniques and Trends
Ifip Tc10 Working Conference: International Embedded Systems Symposium (Iess), May 30 - June 1, 2007, Irvine (Ca), USA2007. Auflage 2007Verlag: Springer UsISBN: 978-0-387-72257-3Medium: Buch106,99 € (inkl. MwSt.)
Lieferzeit ca. 10 Werktage
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Rettberg / Zanella / Rammig Analysis, Architectures and Modelling of Embedded Systems
Third IFIP TC 10 International Embedded Systems Symposium, IESS 2009, Langenargen, Germany, September 14-16, 2009, Proceedings2009Verlag: SpringerISBN: 978-3-642-26019-3Medium: Buch106,99 € (inkl. MwSt.)
Lieferzeit ca. 10 Werktage
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Kleinjohann / Wolf Distributed Embedded Systems: Design, Middleware and Resources
IFIP 20th World Computer Congress, TC10 Working Conference on Distributed and Parallel Embedded Systems (DIPES 2008), September 7-10, 2008, Milano, Italy1. Auflage. Softcover version of original hardcover Auflage 2008Verlag: Springer USISBN: 978-1-4419-3505-2Medium: Buch106,99 € (inkl. MwSt.)
Lieferzeit ca. 10 Werktage
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Kleinjohann / Wolf Distributed Embedded Systems: Design, Middleware and Resources
Ifip 20th World Computer Congress, Tc10 Working Conference on Distributed and Parallel Embedded Systems (Dipes 2008), September 7-10, 2008, Milano, Italy2008. Auflage 2008Verlag: Springer UsISBN: 978-0-387-09660-5Medium: Buch106,99 € (inkl. MwSt.)
Lieferzeit ca. 10 Werktage
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Shin / Tsui / Reis VLSI-SoC: Design for Reliability, Security, and Low Power
23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015, Revised Selected Papers1. Auflage 2016Verlag: Springer International PublishingISBN: 978-3-319-46096-3Medium: Buch53,49 € (inkl. MwSt.)
Lieferzeit ca. 10 Werktage
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Shin / Tsui / Reis VLSI-SoC: Design for Reliability, Security, and Low Power
23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015, Revised Selected PapersSoftcover Nachdruck of the original 1. Auflage 2016Verlag: Springer International PublishingISBN: 978-3-319-83440-5Medium: Buch53,49 € (inkl. MwSt.)
Lieferzeit ca. 10 Werktage
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Burg / Coskun / Reis VLSI-SoC: From Algorithms to Circuits and System-on-Chip Design
20th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2012, Santa Cruz, CA, USA, October 7-10, 2012, Revised Selected Papers2013Verlag: SpringerISBN: 978-3-642-45072-3Medium: Buch53,49 € (inkl. MwSt.)
Lieferzeit ca. 10 Werktage
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Burg / Coskun / Reis VLSI-SoC: From Algorithms to Circuits and System-on-Chip Design
20th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2012, Santa Cruz, CA, USA, October 7-10, 2012, Revised Selected PapersSoftcover Nachdruck of the original 1. Auflage 2013Verlag: SpringerISBN: 978-3-662-52529-6Medium: Buch53,49 € (inkl. MwSt.)
Lieferzeit ca. 10 Werktage
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Maniatakos / Elfadel / Reis VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things
25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23-25, 2017, Revised and Extended Selected Papers1. Auflage 2019Verlag: Springer International PublishingISBN: 978-3-030-15662-6Medium: Buch83,46 € (inkl. MwSt.)
Lieferzeit ca. 10 Werktage
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Maniatakos / Elfadel / Reis VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things
25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23-25, 2017, Revised and Extended Selected Papers1. Auflage 2019Verlag: Springer International PublishingISBN: 978-3-030-15665-7Medium: Buch58,84 € (inkl. MwSt.)
Lieferzeit ca. 10 Werktage
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Bombieri / Pravadelli / Fujita VLSI-SoC: Design and Engineering of Electronics Systems Based on New Computing Paradigms
26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, Verona, Italy, October 8–10, 2018, Revised and Extended Selected Papers1. Auflage 2019Verlag: SpringerISBN: 978-3-030-23427-0Medium: Buch53,49 € (inkl. MwSt.)
Lieferzeit ca. 10 Werktage
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Bombieri / Pravadelli / Reis VLSI-SoC: Design and Engineering of Electronics Systems Based on New Computing Paradigms
26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, Verona, Italy, October 8-10, 2018, Revised and Extended Selected Papers1. Auflage 2019Verlag: Springer International PublishingISBN: 978-3-030-23424-9Medium: Buch53,49 € (inkl. MwSt.)
Lieferzeit ca. 10 Werktage
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Götz / Schirner / Rettberg System Level Design from HW/SW to Memory for Embedded Systems
5th IFIP TC 10 International Embedded Systems Symposium, IESS 2015, Foz do Iguaçu, Brazil, November 3-6, 2015, ProceedingsSoftcover Nachdruck of the original 1. Auflage 2017Verlag: Springer International PublishingISBN: 978-3-030-07917-8Medium: Buch53,49 € (inkl. MwSt.)
Lieferzeit ca. 10 Werktage
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Götz / Schirner / Rettberg System Level Design from HW/SW to Memory for Embedded Systems
5th IFIP TC 10 International Embedded Systems Symposium, IESS 2015, Foz do Iguaçu, Brazil, November 3-6, 2015, Proceedings1. Auflage 2017Verlag: Springer International PublishingISBN: 978-3-319-90022-3Medium: Buch53,49 € (inkl. MwSt.)
Lieferzeit ca. 10 Werktage
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Becker / Reis / De Oliveira Johann VLSI-SoC: Technologies for Systems Integration
17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, Florianópolis, Brazil, October 12-15, 2009, Revised Selected Papers2011Verlag: SpringerISBN: 978-3-642-23119-3Medium: Buch53,49 € (inkl. MwSt.)
Lieferzeit ca. 10 Werktage
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Camarinha-Matos / Ramezani / Parreira-Rocha Technological Innovation for Smart Systems
8th IFIP WG 5.5/SOCOLNET Advanced Doctoral Conference on Computing, Electrical and Industrial Systems, DoCEIS 2017, Costa de Caparica, Portugal, May 3-5, 2017, Proceedings1. Auflage 2017Verlag: Springer Nature SwitzerlandISBN: 978-3-319-56076-2Medium: Buch106,99 € (inkl. MwSt.)
Lieferzeit ca. 10 Werktage
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Becker / Reis / De Oliveira Johann VLSI-SoC: Technologies for Systems Integration
17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, Florianópolis, Brazil, October 12-15, 2009, Revised Selected Papers2011Verlag: SpringerISBN: 978-3-642-27072-7Medium: Buch53,49 € (inkl. MwSt.)
Lieferzeit ca. 10 Werktage
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