Francombe Mechanic and Dielectric Properties

Advances in Research and Development
1. Auflage 2013
ISBN: 978-1-4832-8892-5
Verlag: Elsevier Science & Techn.
Format: PDF
Kopierschutz: 1 - PDF Watermark

E-Book, Englisch, Band Volume 17, 397 Seiten, Web PDF

Reihe: Physics of Thin Films

Mechanic and Dielectric Properties deals with the mechanical and dielectric properties of thin films. Topics covered range from the deposition and mechanical properties of superlattice thin films to the preparation of hard coatings by sputtering and arc evaporation. The use of thin films in microwave acoustics is also discussed, along with ferroelectric films for integrated electronics and the physics, chemistry, and technology of electrochromic tungsten-oxide-based thin films. Comprised of five chapters, this volume begins with an analysis of the growth, characterization, and mechanical behavior of films comprising multilayers primarily of metal and refractory metallic compound components. The next chapter reviews the mechanical properties of hard coatings prepared by sputtering and arc evaporation, together with the influence of multilayer and gradient structures, and of film crystallinity, crystal orientation, and morphology, on properties such as hardness, coating smoothness, and friction behavior. Subsequent chapters focus on the unique role played by piezoelectric films in signal processing devices utilizing bulk or surface acoustic waves; the properties and applications of ferroelectric films in integrated electronics; and the underlying physics and chemistry of electrochromic tungsten-oxide-based thin films. This book should be of interest to physicists.

Autoren/Hrsg.

Francombe, Maurice H.

Inhaltsverzeichnis

1;Front Cover
;1
2;Mechanic and Dielectric Properties;4
3;Copyright Page
;5
4;Table of Contents;6
5;Contributors;10
6;Preface;12
7;Chapter 1. Deposition and Mechanical Properties of Superlattice Thin Films;16
7.1;I. Introduction;17
7.2;II. Deposition Techniques;18
7.3;III. Characterization;23
7.4;IV. Deposition Mechanisms, Structure, and Stability;37
7.5;V. Mechanical Property Measurements;57
7.6;VI. Elastic Properties;62
7.7;VII. Mechanical Strength and Hardness;74
7.8;VIII. Conclusions;86
7.9;Acknowledgments;88
7.10;References;88
8;Chapter 2. Hard Coatings Prepared by Sputtering and Arc Evaporation;94
8.1;I. Introduction;95
8.2;II. Deposition Techniques Based on Sputtering and Evaporation;96
8.3;III. Hard Coatings;115
8.4;IV. Growth and Properties of Hard Coatings;125
8.5;V. Deposition Process;146
8.6;VI. Concluding Remarks;153
8.7;References;154
9;Chapter 3. Thin Films in Microwave Acoustics;160
9.1;I. Introduction;161
9.2;II. Thin Film Materials—Growth and Characterization;163
9.3;III. Surface Wave Device Structures;180
9.4;IV. Bulk Wave Device Structures;194
9.5;V. Emerging Technology;221
9.6;VI. Conclusions;233
9.7;References;234
10;Chapter 4. Ferroelectric Films for Integrated Electronics;240
10.1;I. Introduction and Background;240
10.2;II. Ferroelectric Film Materials;242
10.3;III. Growth and Applications—Examples;256
10.4;IV. Integrated Electronics Issues;304
10.5;V. Conclusions;309
10.6;Acknowledgments;310
10.7;References;310
11;Chapter 5. Electrochromic Tungsten-Oxide–Based Thin Films: Physics, Chemistry, and Technology;316
11.1;I. Introduction;317
11.2;II. Comments on W Oxide Bulk Crystals;319
11.3;III. As-deposited Films: Structure and Composition;322
11.4;IV. Ion Intercalated Films: Electrochemical Characterization;333
11.5;V. Ion Intercalated Films: Physical Characterization;341
11.6;VI. Optical Properties;350
11.7;VII. Device Data;366
11.8;VIII. Summary and Conclusions;377
11.9;References;379
12;Author Index;386
13;Subject Index;404