Singh / Oprysko / Harame Silicon Germanium

Technology, Modeling, and Design
1. Auflage 2004
ISBN: 978-0-471-66091-0
Verlag: John Wiley & Sons
Format: PDF
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)

E-Book, Englisch, 368 Seiten, E-Book

"An excellent introduction to the SiGe BiCMOS technology, from theunderlying device physics to current applications."
-Ron Wilson, EETimes
"SiGe technology has demonstrated the ability to provide excellenthigh-performance characteristics with very low noise, at high powergain, and with excellent linearity. This book is a comprehensivereview of the technology and of the design methods that go withit."
-Alberto Sangiovanni-Vincentelli
Professor, University of California, Berkeley
Cofounder, Chief Technology Officer, Member of Board
Cadence Design Systems Inc.
Filled with in-depth insights and expert advice, Silicon Germaniumcovers all the key aspects of this technology and its applications.Beginning with a brief introduction to and historical perspectiveof IBM's SiGe technology, this comprehensive guide quickly moves onto:
* Detail many of IBM's SiGe technology development programs
* Explore IBM's approach to device modeling andcharacterization-including predictive TCAD modeling
* Discuss IBM's design automation and signal integrity knowledgeand implementation methodologies
* Illustrate design applications in a variety of IBM's SiGetechnologies
* Highlight details of highly integrated SiGe BiCMOS system-on-chip(SOC) design
Written for RF/analog and mixed-signal designers, CAD designers,semiconductor students, and foundry process engineers worldwide,Silicon Germanium provides detailed insight into the modeling anddesign automation requirements for leading-edge RF/analog andmixed-signal products, and illustrates in-depth applications thatcan be implemented using IBM's advanced SiGe process technologiesand design kits.
"This volume provides an excellent introduction to the SiGe BiCMOStechnology, from the underlying device physics to currentapplications. But just as important is the window the text providesinto the infrastructure-the process development, device modeling,and tool development."
-Ron Wilson
Silicon Engineering Editor, EETimes
"This book chronicles the development of SiGe in detail, providesan in-depth look at the modeling and design automation requirementsfor making advanced applications using SiGe possible, andillustrates such applications as implemented using IBM's processtechnologies and design methods."
-John Kelly
Senior Vice President and Group Executive, Technology Group, IBM

Autoren/Hrsg.

Singh, Raminderpal

Oprysko, Modest M.

Harame, David

Inhaltsverzeichnis

Contributors.
Foreword.
Preface.
Acknowledgments.
Introduction.
A Historical Perspective at IBM.
Technology Development.
Modeling and Characterization.
Design Automation and Signal Integrity.
Leading-Edge Applications.
Appendix.
Index.
About the Authors.

Über Autor(innen)

RAMINDERPAL SINGH, PhD, is a Senior Engineer at IBM's RF/AMSDesign Kit Group where he leads various projects related totransmission line model development, substrate modeling, andRF/mixed-signal design methodologies. Dr. Singh has authorednumerous technical publications in the area of signal integrity,and is Director of VSIA, as well as a Senior Member of IEEE.
DAVID L. HARAME, PhD, is Director of the RF/Analog and Mixed SignalProcess Development, Modeling, and Design Automation area at IBM.He is an IEEE Fellow, Executive Committee member of theBipolar/BiCMOS Circuits and Technology Meeting (BCTM), and memberof the Compact Model Council.
MODEST M. OPRYSKO, PhD, joined IBM in 1986 and has held numerousmanagement positions directing technology and applicationdevelopment activities spanning the areas of fiber optics, wireless(infrared and radio frequency technology), packaging technology,and circuit design devoted to communications applications.Currently, he is the Senior Manager of Communication LinkArchitecture, Design and Test.