Buch, Englisch, 192 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 324 g
Buch, Englisch, 192 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 324 g
ISBN: 978-1-4419-4634-8
Verlag: Springer US
Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.
Zielgruppe
Professional/practitioner
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Verbundwerkstoffe
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Elektronik, Optik
- Technische Wissenschaften Sonstige Technologien | Angewandte Technik Bergbau, Hüttenwesen
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Metallische Werkstoffe
- Technische Wissenschaften Technik Allgemein Technische Zuverlässigkeit, Sicherheitstechnik
- Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Metallurgie
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikroprozessoren
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik Industrielle Qualitätskontrolle
Weitere Infos & Material
Background.- Literature Review.- Unified Finite Element Modeling for Prediction of Solder Joint Fatigue.- Validation of Unified FEM for Thermal Cycling and Power.- Development of Fatigue Life Equations Under Low-Cycle Thermal and Power Cycling.- Validation of Unified FEM and Development of Fatigue-life Equations for Vibration.- Universal Predictive Fatigue Life Equation and the Effect of Design Parameters.- Acceleration Factor to Relate Thermal Cycles to Power Cycles for CBGA Packages.- Solder Joint Fatigue Failure under Sequential Thermal and Vibration Environments.- Solder Joint Reliability Assessment for Desktop and Space Applications.
