Accelerated Active Self-Healing for Integrated Circuits
Buch, Englisch, 208 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 512 g
ISBN: 978-3-030-20050-3
Verlag: Springer International Publishing
This book describes methods to address wearout/aging degradations in electronic chips and systems, caused by several physical mechanisms at the device level. The authors introduce a novel technique called accelerated active self-healing, which fixes wearout issues by enabling accelerated recovery. Coverage includes recovery theory, experimental results, implementations and applications, across multiple nodes ranging from planar, FD-SOI to FinFET, based on both foundry provided models and predictive models.
- Presents novel techniques, tested with experiments on real hardware;
- Discusses circuit and system level wearout recovery implementations, many of these designs are portable and friendly to the standard design flow;
- Provides circuit-architecture-system infrastructures that enable the accelerated self-healing for future resilient systems;
- Discusses wearout issues at both transistor and interconnect level, providing solutions that apply to both;
- Includes coverage of resilient aspects of emerging applications such as IoT.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
Introduction to Wearout.- Accelerated Self-Healing Techniques for BTI Wearout.- Accelerating and Activating Recovery for EM Wearout.- Circuit Techniques for Accelerated and Active Recovery.- Accelerated Self-Healing as a Key Design Knob for Cross-Layer Resilience.- Design and Aging Challenges in FinFET Circuits and Internet of Things (IoT) Applications.- Future Directions in Self-Healing.