Sonstiges, Englisch, 516 Seiten, Format (B × H): 124 mm x 140 mm, Gewicht: 56 g
Reihe: ETG-Fachbericht
12th International Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany
Sonstiges, Englisch, 516 Seiten, Format (B × H): 124 mm x 140 mm, Gewicht: 56 g
Reihe: ETG-Fachbericht
ISBN: 978-3-8007-5757-2
Verlag: VDE Verlag
In the next decades, power electronic system development will be driven by energy saving systems, intelligent energy management, power quality, system miniaturization and high reliability. Monolithic and hybrid system integration will include advanced device concepts including wide bandgap devices, new packaging technologies and the overall integration of actuators/drives (mechatronic integration).
CIPS is consequently focused on the following main aspects:
- assembly and interconnect technology for power electronic devices and converters
- integration of hybrid systems and mechatronic systems with high power density
- systems‘ and components‘ operational behavior and reliability
Basic technologies for integrated power electronic systems as well as upcoming new important applications will be presented in interdisciplinary invited papers.
In 2022 the successful story of CIPS will continue as the conference focus is today more important than ever – increasing functionality, energy efficiency and system reliability while decreasing cost.
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Elektronische Baugruppen, Elektronische Materialien
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Maschinenbau Mechatronik, Mikrosysteme (MEMS), Nanosysteme
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Leistungselektronik
- Technische Wissenschaften Energietechnik | Elektrotechnik Energieeffizienz
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise
