Modeling and Simulation of High Speed VLSI Interconnects

A Special Issue of Analog Integrated Circuits and Signal Processing An International Journal Vol. 5, No. 1 (1994)
Softcover Nachdruck of the original 1. Auflage 1994
ISBN: 978-1-4613-6171-8
Verlag: Springer US

Buch, Englisch, 108 Seiten, Format (B × H): 195 mm x 260 mm, Gewicht: 255 g

brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area.
serves as an excellent reference, providing insight into some of the most important issues in the field.

Zielgruppe

Research

Autoren/Hrsg.

Zhang, Q. J.

Nakhla, Michel S.

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise
• Mathematik | Informatik EDV | Informatik Informatik Mathematik für Informatiker
• Technische Wissenschaften Energietechnik | Elektrotechnik Elektrotechnik
• Technische Wissenschaften Elektronik | Nachrichtentechnik Nachrichten- und Kommunikationstechnik Signalverarbeitung

Inhaltsverzeichnis

Guest Editors’ Introduction.- Efficient Transient Analysis of Nonlinearly Loaded Low-Loss Multiconductor Interconnects.- A Simplified Synthesis of Transmission Lines with a Tree Structure.- An Interconnect Model for Arbitrary Terminations Based on Scattering Parameters.- Electromagnetic Analysis of Multiconductor Losses and Disperion in High-Speed Interconnects.- Circuit Modeling of General Hybrid Uniform Waveguide Structures in Chiral Anisotropic Inhomogeneous Media.- An Efficient, CAD-Oriented Model for the Characteristic Parameters of Multiconductor Buses in High-Speed Digital GaAs ICs.- Full-Wave Analysis of Radiation Effect of Microstrip Transmission Lines.- Optimizing VLSI Interconnect Model for SPICE Simulation.- Statistical Simulation and Optimization of High-Speed VLSI Interconnects.