Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs

1. Auflage. Softcover version of original hardcover Auflage 1999
ISBN: 978-1-4419-5085-7
Verlag: Springer US

Buch, Englisch, 240 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 388 g

Modern microelectronic design is characterized by the integration of full systems on a single die. These systems often include large high performance digital circuitry, high resolution analog parts, high driving I/O, and maybe RF sections. Designers of such systems are constantly faced with the challenge to achieve compatibility in electrical characteristics of every section: some circuitry presents fast transients and large consumption spikes, whereas others require quiet environments to achieve resolutions well beyond millivolts. Coupling between those sections is usually unavoidable, since the entire system shares the same silicon substrate bulk and the same package. Understanding the way coupling is produced, and knowing methods to isolate coupled circuitry, and how to apply every method, is then mandatory knowledge for every IC designer.
is an in-depth look at coupling through the common silicon substrate, and noise at the power supply lines. It explains the elementary knowledge needed to understand these phenomena and presents a review of previous works and new research results. The aim is to provide an understanding of the reasons for these particular ways of coupling, review and suggest solutions to noise coupling, and provide criteria to apply noise reduction.
is an ideal book, both as introductory material to noise-coupling problems in mixed-signal ICs, and for more advanced designers facing this problem.

Zielgruppe

Research

Autoren/Hrsg.

Aragones, X.

Rubio, Antonio

Gonzalez, J.L.

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikroprozessoren
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise

Inhaltsverzeichnis

1. Introduction.- 2. Substrate noise characteristics and propagation.- 3. Substrate coupling modeling.- 4. Substrate biasing and noise coupling.- 5. Alternative proposals for reducing substrate noise.- 6. Experimental measurements performed on a mixed-signal IC.- 7. The cause of switching noise.- 8. Digital design for low switching noise.- 9. Techniques and circuits for reducing switching noise.- 10. Conclusions.