Cressler | Fabrication of SiGe HBT BiCMOS Technology | Buch | 978-1-4200-6687-6 | sack.de

Buch, Englisch, 258 Seiten, Format (B × H): 178 mm x 254 mm, Gewicht: 612 g

Cressler

Fabrication of SiGe HBT BiCMOS Technology


1. Auflage 2007
ISBN: 978-1-4200-6687-6
Verlag: Taylor & Francis Inc

Buch, Englisch, 258 Seiten, Format (B × H): 178 mm x 254 mm, Gewicht: 612 g

ISBN: 978-1-4200-6687-6
Verlag: Taylor & Francis Inc


SiGe HBT BiCMOS technology is the obvious groundbreaker of the Si heterostructures application space. To date virtually every major player in the communications electronics market either has SiGe up and running in-house or is using someone else’s SiGe fab as foundry for their designers. Key to this success lies in successful integration of the SiGe HBT and Si CMOS, with no loss of performance from either device. Filled with contributions from leading experts, Fabrication of SiGe HBT BiCMOS Technologies brings together a complete discussion of these topics into a single resource.
Drawn from the comprehensive and well-reviewed Silicon Heterostructure Handbook, this volume examines the design, fabrication, and application of silicon heterostructure transistors. A novel aspect of this book the inclusion of numerous snapshot views of the industrial state-of-the-art for SiGe HBT BiCMOS technology. It has been carefully designed to provide a useful basis of comparison for the current status and future course of the global industry. In addition to the copious technical material and the numerous references contained in each chapter, the book includes easy-to-reference appendices on the properties of Si and Ge, the generalized Moll-Ross relations, integral charge-control relations, and sample SiGe HBT compact model parameters.

Cressler Fabrication of SiGe HBT BiCMOS Technology jetzt bestellen!

Autoren/Hrsg.


Weitere Infos & Material


The Big Picture. A Brief History of the Field. Overview: Fabrication of SiGe HBT BiCMOS Technology. Device Structures and BiCMOS Integration Issues. SiGe HBTs on CMOS-Compatible SOI J. Passive Components. Industry Examples at State-of-the-Art: IBM. Industry Examples at State-of-the-Art: Jazz. Industry Examples at State-of-the-Art: Hitachi. Industry Examples at State-of-the-Art: Infineon. Industry Examples at State-of-the-Art: IHP. Industry Examples at State-of-the-Art: ST. Industry Examples at State-of-the-Art: TI. Industry Examples at State-of-the-Art: Philips.


John D. Cressler



Ihre Fragen, Wünsche oder Anmerkungen
Vorname*
Nachname*
Ihre E-Mail-Adresse*
Kundennr.
Ihre Nachricht*
Lediglich mit * gekennzeichnete Felder sind Pflichtfelder.
Wenn Sie die im Kontaktformular eingegebenen Daten durch Klick auf den nachfolgenden Button übersenden, erklären Sie sich damit einverstanden, dass wir Ihr Angaben für die Beantwortung Ihrer Anfrage verwenden. Selbstverständlich werden Ihre Daten vertraulich behandelt und nicht an Dritte weitergegeben. Sie können der Verwendung Ihrer Daten jederzeit widersprechen. Das Datenhandling bei Sack Fachmedien erklären wir Ihnen in unserer Datenschutzerklärung.