Dagenais / Crow Integrated Optoelectronics

1. Auflage 2013
ISBN: 978-1-4832-8839-0
Verlag: Elsevier Science & Techn.
Format: PDF
Kopierschutz: 1 - PDF Watermark

E-Book, Englisch, 686 Seiten, Web PDF

Reihe: Quantum Electronics--Principles and Applications

Integrated optoelectronics is becoming ever more important to communications, computer, and consumer industries. It is the enabling technology in a variety of systems, ranging from low-cost, robust optical componentsin consumer electronics to high-performance broadband information networks capable of supporting video and multimedia conferencing. The requirements for producing low-cost, highly reliable components for deployment in these new systems have created a technology challenge. Integrated optoelectronics promises to meet the performance and cost objectives of these applications by integrating both optical and electronic components in a highly functional chip. This book provides an overview of this exciting newtechnology.Integrated Optoelectronics brings together a group of acknowledged experts from both universities and industry around the world to focus on a common theme of integration. These experts have reported not only on the state-of-the-art, but also on the physics and design experience that goes into implementing integrated chips and modules. This book is a cohesive series of articles that includes a discussion of the intimate trade-offs between materials, processes, devices, functional blocks, packaging,and systems requirements in a truly integrated technology. This integration encompasses electrical, optoelectronic, and optical devices onto monolithic or hybrid chips, and into multichip modules.This volume surveys state-of-the-art research activities in integrated optoelectronics and gathers most of the important references into a single place. It outlines the major issues involved in integrating both optical and electronic components, provides an overview of design and fabrication concepts, and discusses the issues involved in bringing these new chips to the marketplace.This exciting new book:Provides a broad overview of the optoelectronic field, including materials processing, devices, and systems applicationsFeatures authors who are acknowledged research experts in this field, from both industry and universities around the worldIncludes new information on device fabrication, including the latest epitaxial growth and lift-off techniques to permit the mixing of dissimilar materials onto single chipsCovers planar processed laser fabrication leading to wafer level automated testingDiscusses optimization of devices for integration, including a detailed treatment of the vertical emitting laser and theoretical and experimental coverage of optimization of photodetectors for integration into receiver chipsDescribes design approaches for multifunctional chips, including photonic circuits for all-optical networks and the design of integrated optoelectronic chips with lasers, photodiodes, and electronic ICsCovers the infrastructure needed to support an integrated technology, including automated design systems which treat both optical and electrical circuits, and multichip packaging approaches for both optical and IC chips

Autoren/Hrsg.

Dagenais, Mario

Crow, John

Inhaltsverzeichnis

1;Front Cover;1
2;Integrated Optoelectronics;4
3;Copyright Page;5
4;Table of Contents;6
5;Contributors;12
6;Preface;14
7;PART I: SYSTEM REQUIREMENTS FOR OEICs;18
7.1;Chapter 1. TELECOMMUNICATIONS SYSTEM APPLICATIONS FOR OPTOELECTRONIC INTEGRATED CIRCUITS;20
7.1.1;1. Why Optoelectronic Integration?;20
7.1.2;2. A Vision of the Future Broadband Network;22
7.1.3;3. Access to the Broadband Network;26
7.1.4;4. Linear Lightwave Networks;42
7.1.5;5. Conclusions;44
7.1.6;Appendix: Functional OEIC Catalog;47
7.1.7;References;53
7.2;Chapter 2. COMPUTING SYSTEM APPLICATIONS;56
7.2.1;1. Introduction;56
7.2.2;2. Trends in the Computer Industry;59
7.2.3;3. System-Level Issues Related to Technology Requirements;70
7.2.4;4. Optoelectronics Technology Requirements and Status;75
7.2.5;5. Opportunities and Requirements for an OEIC Technology;90
7.2.6;6. Summary;94
7.2.7;References;96
8;PART II: MATERIALS GROWTH;98
8.1;Chapter 3. MOLECULAR BEAM EPITAXY WITH GASEOUS SOURCES;100
8.1.1;1. Introduction;100
8.1.2;2. Gas-Source MBE;103
8.1.3;3. MOMBE and CBE;118
8.1.4;4. Selective-Area Growth;125
8.1.5;5. Alternative Sources;130
8.1.6;6. Concluding Remarks;132
8.1.7;ACKNOWLEDGMENTS;132
8.1.8;References;133
8.2;Chapter 4. ORGANOMETALLIC CHEMICAL VAPOR DEPOSITION FOR OPTOELECTRONIC INTEGRATED CIRCUITS;138
8.2.1;1. Introduction;138
8.2.2;2. Materials Capabilities for OEIC Fabrication;141
8.2.3;3. Uniformity and Scale-Up;157
8.2.4;4. Safety;157
8.2.5;5. Conclusions;158
8.2.6;References;158
8.3;Chapter 5. LATTICE-MISMATCHED HETEROEPITAXY;162
8.3.1;1. Introduction;162
8.3.2;2. Strained Layers and Related Growth Issues;164
8.3.3;3. Heteroepitaxy;167
8.3.4;4. Dislocations and Other Defects;182
8.3.5;5. Dislocation Reduction;190
8.3.6;6. Optoelectronic Devices on Silicon Substrates;197
8.3.7;7. Monolithic Devices;218
8.3.8;8. Conclusions;220
8.3.9;References;220
9;PART III: DEVICE PROCESSING;228
10;Chapter 6. FOCUSED ION BEAM FABRICATION TECHNIQUES FOR OPTOELECTRONICS;230
10.1;1. INTRODUCTION;230
10.2;2. Focused Ion Beam Systems;231
10.3;3. Micromachining;233
10.4;4. Maskless Implantation;251
10.5;5. Lithography for in Situ Processing;262
10.6;6. Summary;269
10.7;References;271
11;Chapter 7. FULL-WAFER TECHNOLOGY FOR LARGE-SCALE LASER FABRICATION AND INTEGRATION;274
11.1;1. Introduction;274
11.2;2. Cleaved Mirror Technology;276
11.3;3. Etched Mirror Technology;278
11.4;4. Full-Wafer Processing;283
11.5;5. Etched Mirror Characterization;292
11.6;6. Full-Wafer Testing;296
11.7;7. Summary;307
11.8;References;311
12;Chapter 8. EPITAXIAL LIFT-OFF AND RELATED TECHNIQUES;314
12.1;1. Introduction;314
12.2;2. Technique;316
12.3;3. Applications;321
12.4;4. Unanswered Questions;323
12.5;5. Outlook;325
12.6;6. Conclusion;326
12.7;References;326
13;PART IV: STATE-OF-THE-ART DISCRETE COMPONENTS;332
14;Chapter 9. ELECTRONICS FOR OPTOELECTRONIC INTEGRATED CIRCUITS;334
14.1;1. Device Noise Performance;343
14.2;2. Receiver Noise in Field Effect Transistors;343
14.3;3. Noise in Bipolar Transistors;344
14.4;4. Heterojunction Bipolar Transistor Designs;344
14.5;5. Heterojunction Bipolar Transistor Device Geometry;347
14.6;6. High-Performance FET Designs;349
14.7;7. Optoelectronic Integrated Circuits;351
14.8;References;353
15;Chapter 10. LASERS AND MODULATORS FOR OEICS;356
15.1;1. Introduction;356
15.2;2. Lasers for OIECs;360
15.3;3. Modulators for OEICs;412
15.4;References;426
16;Chapter 11. PHOTODETECTORS FOR OPTOELECTRONIC INTEGRATED CIRCUITS;436
16.1;1. Introduction;436
16.2;2. p-i-n Photodiodes;438
16.3;3. MSM Photodiodes;447
16.4;4. Conclusion;458
16.5;References;458
17;PART V: OPTOELECTRONIC INTEGRATED CIRCUITS (OEICs);462
18;Chapter 12. CURRENT STATUS OF OPTOELECTRONIC INTEGRATED CIRCUITS;464
18.1;1. Introduction;464
18.2;2. Categories and Advantages of Integrated Optoelectronics;465
18.3;3. Status of Optoelectronic Integrated Circuit Development;468
18.4;4. Technological Challenges;487
18.5;5. Concluding Remarks;497
18.6;References;499
19;Chapter 13. SCALING AND SYSTEM ISSUES OF OEIC DESIGN;506
19.1;1. Introduction;506
19.2;2. Medium-Scale OEIC Transmitters;508
19.3;3. Medium-Scale OEIC Receivers;519
19.4;4. Challenges for Large-Scale OEICS;530
19.5;5. Summary;542
19.6;References;542
20;Chapter 14. MODELING FOR OPTOELECTRONIC INTEGRATED CIRCUITS;546
20.1;1. Introduction;546
20.2;2. Modeling of Material Structures;548
20.3;3. Modeling of Waveguide Devices;553
20.4;4. Modeling of Laser Diodes;558
20.5;5. Coupling Problems;563
20.6;6. System Noise Analysis;565
20.7;7. Conclusion;568
20.8;References;569
21;Chapter 15. PHOTONIC INTEGRATED CIRCUITS;574
21.1;1. Introduction;575
21.2;2. Guided-Wave Design Tools;577
21.3;3. Active/Passive Waveguide Coupling and Design Issues;588
21.4;4. Crystal Growth and PIC Processing;603
21.5;5. Illustrative Examples of PIC Applications;619
21.6;6. Conclusions;633
21.7;References;636
22;Chapter 16. PACKAGING INTEGRATED OPTOELECTRONICS;644
22.1;1. Introduction;644
22.2;2. Electrical Noise and Distortion in Array Optical Packages;647
22.3;3. Many Simultaneous OEIC Chip Connections, Both Electrical and Optical;650
22.4;References;660
23;Chapter 17. FUTURE OEICs: THE BASIS FOR PHOTOELECTRONIC INTEGRATED SYSTEMS;662
23.1;1. Introduction;662
23.2;2. Design Trial of the Optical Interconnection in ULSI Microprocessors;665
23.3;3. Three-Dimensional Integrated Circuits Using Vertical Optical Interconnections;682
23.4;4. Summary and Future Prospects;684
23.5;References;689
24;INDEX;694