Dennis / Such Nickel and Chromium Plating

2. Auflage 2013
ISBN: 978-1-4831-6340-6
Verlag: Elsevier Science & Techn.
Format: PDF
Kopierschutz: 1 - PDF Watermark

E-Book, Englisch, 400 Seiten, Web PDF

Nickel and Chromium Plating, Second Edition, does not merely update the first edition but also places additional emphasis on certain methods that have achieved increased industrial use in the 14 years since the first edition was published. The book begins by tracing the history of nickel and chromium plating. This is followed by a discussion of the electrochemistry of electrodeposition from aqueous electrolyte solutions. Separate chapters cover topics such as autocatalytic (electroless) nickel deposition; nickel plating onto aluminum and other difficult substrates; plating onto plastics and high-speed plating; the deposition of various nickel alloys for decorative and functional applications; composite coatings; and tampon (brush) plating. This book will be helpful to those new to the plating industry; those experienced in the industry will find that this revised version enables them to keep up-to-date with the latest developments in this specialized technology.

Autoren/Hrsg.

Dennis, J. K.

Such, T. E.

Inhaltsverzeichnis

1;Front Cover;1
2;Nickel and Chromium Plating;4
3;Copyright Page;5
4;Table of Contents;10
5;Preface to the first edition;6
6;Preface to the second edition;8
7;Chapter 1. Introduction and historical review;12
7.1;History of nickel plating;14
7.2;Nickel anodes;18
7.3;History of chromium plating;19
7.4;References;20
7.5;Bibliography;21
8;Chapter 2. Metallurgical aspects of electrodeposition;23
8.1;Methods of examination of structure and surface topography;23
8.2;Optical microscopy;23
8.3;Electron microscopy;26
8.4;Electron probe microanalysis;29
8.5;X-ray techniques;31
8.6;Nucleation and growth of electrodeposits;31
8.7;Copper deposition;32
8.8;Nickel deposition;34
8.9;Chromium deposition;37
8.10;Structure of electrodeposits;38
8.11;Structure and surface topography of electrodeposited nickel;40
8.12;Structure and surface topography of electrodeposited chromium;45
8.13;References;46
8.14;Bibliography;46
9;Chapter 3. Electroplating baths and anodes used for industrial nickel deposition;47
9.1;Plating baths Watts nickel bath;47
9.2;Hard Watts bath;49
9.3;Nickel sulphate bath;49
9.4;All chloride and high-chloride baths;49
9.5;Nickel sulphamate bath;50
9.6;Nickel fluoborate bath;52
9.7;Anode processes;52
9.8;Anodes for nickel plating;52
9.9;Depolarized anodes;53
9.10;Carbon-containing anodes;54
9.11;Primary nickel;54
9.12;Anode baskets;56
9.13;Inert anodes;58
9.14;Black nickel;59
9.15;Barrel nickel plating;61
9.16;References;64
9.17;Bibliography;65
10;Chapter 4. Engineering applications;66
10.1;Applications of thick electrodeposits;66
10.2;Types of nickel plating solutions used;68
10.3;Mechanical properties;72
10.4;Composite coatings;72
10.5;Effect of plated coatings on fatigue strength;75
10.6;Electroforming;78
10.7;Chromium electrodeposits;80
10.8;Fatigue characteristics of nickel- and chromium-plated titanium alloys;84
10.9;References;85
10.10;Bibliography;86
11;Chapter 5. Bright nickel electroplating;88
11.1;Brighteners;88
11.2;Levellers;89
11.3;Stress relievers;94
11.4;Wetting agents;95
11.5;Properties of electrodeposited bright nickel;95
11.6;Brightness;95
11.7;Reflectivity;96
11.8;Roughness and pitting;96
11.9;Porosity;97
11.10;Chromability;98
11.11;Adhesion and surface preparation;98
11.12;Ductility;100
11.13;Internal stress;101
11.14;Hardness;101
11.15;Effect of hydrogen absorption;101
11.16;Cathode and anode efficiencies;103
11.17;Operating range;103
11.18;Simplicity of operation;104
11.19;Throwing power;104
11.20;The incorporation and effect of organic addition agents;106
11.21;Cathodic reduction;107
11.22;Interaction of organic additions;109
11.23;Levelling;110
11.24;Effect of additives on structure;115
11.25;Grain size, orientation and brightness of electrodeposits;116
11.26;Effect of additions on stress, ductility and hardness;117
11.27;References;118
12;Chapter 6. Control and purification of nickel electroplating solutions;121
12.1;Control of organic constituents;122
12.2;Common contaminants of nickel plating baths;123
12.3;Types of inorganic contamination;124
12.4;Effect of metallic contamination on structure and properties of nickel deposits;127
12.5;Mechanical properties;137
12.6;Corrosion resistance;138
12.7;Analysis for inorganic impurities;138
12.8;Removal of metallic contamination;139
12.9;Types of organic contamination;141
12.10;Analysis for organic impurities;142
12.11;Removal of organic contamination;143
12.12;Filtration of electroplating baths;144
12.13;References;145
13;Chapter 7. Physical and mechanical properties of electrodeposits and methods of determination;147
13.1;Ductility;147
13.2;Comparison of bend and tensile tests;151
13.3;Adhesion;155
13.4;Causes of poor adhesion;156
13.5;Methods of determination of adhesion;157
13.6;Stress;163
13.7;Methods of measuring internal stress;163
13.8;Theories proposed to account for internal stress in electrodeposits;171
13.9;Hardness and wear resistance;174
13.10;Methods of hardness measurement;175
13.11;Assessment of surface quality - brightness, reflectivity and surface roughness;177
13.12;Guild reflectometer;177
13.13;Surface roughness;181
13.14;References;184
13.15;Bibliography;186
14;Chapter 8. Chromium plating;187
14.1;The mechanism of deposition from chromic acid plating baths;188
14.2;Baths based on chromic acid;189
14.3;Hard chromium deposition;192
14.4;Self-regulating high-speed (SRHS) baths;194
14.5;Crack-free chromium;195
14.6;Micro-cracked chromium;195
14.7;Variables affecting micro-cracking;197
14.8;Tetrachromate baths;202
14.9;Black chromium;203
14.10;Electrodeposition from trivalent baths;204
14.11;Stress in chromium deposits;207
14.12;Spray control;210
14.13;Anodes;211
14.14;Barrel chromium plating;211
14.15;References;212
14.16;Bibliography;215
15;Chapter 9. Thickness and corrosion testing of nickel plus chromium coatings;216
15.1;Thickness testing;216
15.2;Corrosion testing;221
15.3;Corrodkote test;224
15.4;Outdoor tests;226
15.5;Choice of test;228
15.6;Methods of evaluation of corrosion results;228
15.7;The ISO 454039 method;228
15.8;British Standards institution method;231
15.9;References;238
15.10;Bibliography;239
16;Chapter 10. Decorative nickel plus chromium coating combinations;240
16.1;Modification of the nickel plus chromium system;242
16.2;Multi-layer nickel coatings Double layer nickel;243
16.3;Three layer nickel system;247
16.4;Industrial practice;248
16.5;Multi-layer coatings of dissimilar metals;249
16.6;Satin nickel;251
16.7;Modifications of the chromium layer;254
16.8;Copper undercoats;264
16.9;Effect of copper undercoats;269
16.10;Corrosion resistance of deformed nickel plus chromium coatings;272
16.11;References;277
17;Chapter 11. Autocatalytic deposition of nickel;280
17.1;Phosphorus alloys;283
17.2;Nickel/boron alloys;288
17.3;Pure autocatalytic nickel;291
17.4;Autocatalytic nickel coatings with non-metallic inclusions;292
17.5;Autocatalytic nickel/PTFE composites;293
17.6;References;294
18;Chapter 12. Electroplating onto plastics;297
18.1;Plating of ABS plastics;298
18.2;Mechanism of pretreatment processes;303
18.3;Adhesion;309
18.4;Mechanical properties;317
18.5;Selective area plating of plastics;321
18.6;References;323
19;Chapter 13. Deposition of nickel alloys;326
19.1;Nickel/cobalt alloys;326
19.2;Engineering applications;329
19.3;Nickel/iron alloys;331
19.4;Magnetic applications;334
19.5;Nickel/tin alloys;335
19.6;Nickel/molybdenum and nickel/tungsten alloys;336
19.7;Nickel/phosphorus alloys;337
19.8;Nickel/manganese alloys;338
19.9;Nickel/chromium alloys;338
19.10;Miscellaneous alloys;339
19.11;Palladium/nickel alloys;341
19.12;Zinc/nickel alloys;342
19.13;References;343
20;Chapter 14. Plating on difficult-to-plate metals;345
20.1;Aluminium;345
20.2;Methods of plating on aluminium;346
20.3;Note;363
20.4;Preparation of uncommon metals for nickel plating;363
20.5;References;372
20.6;Bibliography;374
21;Chapter 15. High-speed plating;375
21.1;Electrochemical factors;375
21.2;Plating solution composition;378
21.3;Methods used to increase the rate of deposition;379
21.4;Cathode movement;379
21.5;Air agitation;379
21.6;Paddles and impellers;380
21.7;Jet plating;380
21.8;Turbulent flow;380
21.9;Ultrasonic agitation;381
21.10;Current pulsing;382
21.11;Laser-enhanced plating;382
21.12;Brush plating;383
21.13;Abrasive plating;384
21.14;Abrasive bonded to flexible pad;386
21.15;Vibratory tub;387
21.16;Fluidized-bed techniques;387
21.17;Properties of deposits plated at high current density;388
21.18;References;388
21.19;Bibliography;389
22;Index;390
23;HIGH TEMPERATURE TECHNOLOGY;398
24;The World's Leading Journal Covering the Science and Technology of Ultrasound;399