Osseointegration of Orthopaedic Implants

Erscheinungsjahr 2019
ISBN: 978-0-12-813384-2
Verlag: Elsevier Science Publishing Co Inc

Buch, Englisch, 210 Seiten, Format (B × H): 228 mm x 152 mm, Gewicht: 344 g

Osseointegration of Orthopaedic Implants helps product developers at orthopedic implant manufacturers enhance the effectiveness of orthopedic implants and reduce complications, particularly in patients with osteoporotic bones. The book's expert contributors provide cutting-edge information on the latest technologies and advances available. Biomaterial researchers can use the book for basic data in the further development of orthopedic implant materials with better osseointegration. Biomechanical researchers can review related challenges and concepts of osseointegration for use in the development of implants. The book is suitable for readers from academia and industry, bridging the knowledge gap between academic based researchers, industrial based engineers, and clinical based surgeons.

Zielgruppe

<p>Product Developers at orthopaedic implant manufacturers, Biomechanical researchers, Biomaterial researchers, Biomedical engineering lecturers and students, Medical implants institutes </p>

Autoren/Hrsg.

Goharian, Amirhossein

Fachgebiete

• Medizin | Veterinärmedizin Medizin | Public Health | Pharmazie | Zahnmedizin Medizin, Gesundheitswesen Medizintechnik, Biomedizintechnik, Medizinische Werkstoffe
• Technische Wissenschaften Sonstige Technologien | Angewandte Technik Medizintechnik, Biomedizintechnik
• Medizin | Veterinärmedizin Medizin | Public Health | Pharmazie | Zahnmedizin Vorklinische Medizin: Grundlagenfächer Biomechanik
• Medizin | Veterinärmedizin Medizin | Public Health | Pharmazie | Zahnmedizin Chirurgie Orthopädie- und Unfallchirurgie

Inhaltsverzeichnis

Part I General topics in osteointegration1. Biology of bone tissue2. History of osteointegration 3. Basic science research and clinical findings of osteointegration

Part II Overview of orthopedic implants4. Implant loosening 5. Bone fracture fixation implants6. Joint replacement prostheses7. Tissue engineering scaffolds

Part III Biomaterials for enhancement of osteointegration8. Osteoconductive materials9. Osteoinductive materials10. Bioactive materials

Part IV Surface treatments for enhancement of osteointegration11. Bioactive coating12. Porous surface13. Surface treatment

Part V Biological concepts and challenges of osteointegration14. Bone tissue in-growth and on-growth15. Body fluid rate effect on osteointegration16. Osteoinductivity and Osteoconductivity

Part VI Mechanical concepts and challenges of osteointegration17. Load transferring mechanism between bone and implant 18. Osteointegration in long term implantation19. Stress shielding effect on osteointegration20. Biomechanical concepts of scaffolding

Part VII Novel development concepts21. Novel development concepts of implant osteointegration22. Transition layer concept23. Improvement of long term bioactivity at transition layer24. Enhancement of load transferring at transition layer25. Development of shape memory concept at transition layer26. Promoting osteointegration of physiological loading cycles at early implantation

Über Autor(innen)

Goharian, Amirhossein
Amirhossein Goharian is a Senior Engineer working in the orthopedic implant industry. He earned his Bachelor's degree from the University of Kashan in 2007, and his completed his Master's in Mechanical Engineering in Biomechanics at the University Technology Malaysia (UTM) in 2012. He joined the R&D department of LEONIX Sdn. Bhd., Penang, Malaysia, in 2012, rising to Senior R&D Leader in Jan 2015. In 2017, he joined Isfahan Orthopedic Implant Development Co., an orthopedic implant manufacturer in Isfahan, Iran, as the QA-R&D leader until Sep 2020. Since then, he has been developing innovations in the field of orthopedic implants, based on ideas set out in his published work. Goharian has previously published three books with Elsevier, covering trauma plating systems, osseointegration and surface engineering of orthopedic implants.