Buch, Englisch, 544 Seiten, Format (B × H): 170 mm x 240 mm, Gewicht: 1100 g
ISBN: 978-0-87849-364-7
Verlag: Trans Tech Publications
This volume comprises a collection of 88 selected papers, contributed by experts from all over the world and subjected to rigorous peer-review and revision in order to ensure originality and quality. The topics covered include new developments and applications in grinding, polishing, CMP, silicon-wafer processing and field-assisted abrasive machining technologies, plus novel techniques and new insights into dressing and truing for grinding processes and, in addition, abrasive-jet processing. It also covers further topics which are relevant to precision manufacturing: including the nano-processing of brittle materials, precision measurements and evaluation of high-precision components, micro-fabrication, and advanced machining technologies such as ecological and high-speed machining.
This book therefore provides an invaluable up-to-date reference work for researchers in the abrasive technology field who wish to understand, in depth, the underlying mechanisms and to create new and practical technologies, systems and processes. It will also be particularly useful for practising engineers in precision manufacturing who are responsible for maintaining efficient and effective operations.
Autoren/Hrsg.
Weitere Infos & Material
Prediction of Grinding Force Distribution in Wheel and Workpiece Contact Zone Study on the Subsurface Damage of Single Crystal MgO SubstratesStudy on Improvement of Material Removal Rate in Chemo-Mechanical Grinding (CMG) of Si Wafer Comparative Study on the Materials Removal Mechanism of Ceramics and SteelsGrinding of Carbon/Epoxy Composites Using Electroplated CBN Wheel with Controlled Abrasive ClustersExperimental Analysis of Elastic and Plastic Behavior in Ductile-Regime Machining of Glass Quartz Utilizing a Diamond ToolCharacteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon WafersFractal Analysis of Self-Sharpening Phenomenon in cBN GrindingObservation of Abrasive Grains Behavior in Contact Area of Grinding Wheel and Comparison with Grinding Wheel ModelThermal Damage of Micro Diameter Hole Drilled by Super-High-Speed Spindle in PWB Experimental Trial of Fullerene Wheel FabricationResearch of Ultrahigh Speed Grinding Spindle System Based on Squeeze Film Damping TechnologyDevelopment of CNT-Coated Diamond Grains Using Self-Assembly Techniques for Improving Electroplated Diamond ToolsProposal of Pulverization Method Based on Grinding Process in Order to Recycle FRP WasteError Analysis and Robust Position Measurement for Vertex of a Small Polyhedron Grinding Burn and Chatter Classification Using Genetic ProgrammingControl of Nano-Topography on an Axisymmetric Ground SurfaceMeasurement of High-NA Axisymmetric Aspherical Surface with Continuous Interference Method Observation of Grinding Wheel Wear Patterns by Means of a 3-Dimensional Digital Measuring MethodNumerical Analysis for Thermal Deformation of Workpiece in Cylindrical Plunge Grinding Fuzzy Rules for Surface Roughness of Ground SteelsGeometrical Simulation of Surface Finish Improvement in Helical Scan Grinding Method by Means of 3D-CAD ModelPlaning of Cobalt-Free Tungsten Carbide Using a Diamond Tool -Cutting Temperature and Tool Wear-Cutting Temperature Measurement in Turning with Actively Driven Rotary Tool Coolant Effects on Tool Wear in Machining Single-Crystal Silicon with Diamond Tools Machinability Investigation of Reaction-Bonded Silicon Carbide by Single-Point Diamond TurningHigh Speed Cutting of Titanium Alloy with PCD Tools Development of DLC Coated Tool for Cutting of Aluminum Alloy -Influence of Deposition Condition on Cutting Characteristic-Observations on Orthogonal Cutting Processes - Effect of Friction between Tool and Work Material -Development of A New Cutting Fluid Supply System for Near Dry Machining ProcessStudy on the Surface Quality of Optical Glass in Ultrasonic-Magnetorheological Compound FinishingQuartz Wafer Machining Using MCF (Magnetic Compound Fluid) Polishing Liquid Frozen with Liquid NitrogenSimulation and Experimental Analysis of Electromagnetic Inductor for Magnetic Abrasive FinishingThe Research of NC Magnetic Abrasive Finishing for Mould Parting SurfaceComputer Aided Design and Grinding for Helical Drill Points A New CBN Crystal for Improved Grinding Performance in Vitrified Bonds Study on Two Kinds of Grinding Wheels for Dynamic Friction Polishing of CVD Diamond FilmFundamental Study on the Precision Abrasive Machining Using a Cavitation in Reversing Suction FlowResearches on Effect of Impact Micro-Damages in Contact Layer on Machinability in Quick-Point Grinding Study on Abrasive Geometry of Quick-Point Grinding Model-Based Compensation of Geometry-Errors when Grinding Material Compounds A New Type of Drill Grinder Based on the Special Universal Joint Simulation of Dynamic Performance for Hydro-Hybrid Spindle-Bearing System of Superhigh Speed GrinderModel Based Characterization of the Grinding Wheel Effective Topography Fabrication of High-Aspect Ratio Micro Holes on Hard Brittle Materials -Study on Electrorheological Fluid-Assisted Micro Ultrasonic Machining- Grinding of Soft Steel with Assistance of Ultrasonic VibrationsUltrasonic Vibration-Assisted Cutting of Titanium Alloy Effects of Grain Size and Concentration of Grinding Wheel in Ultrasonically Assisted GrindingElectrochemical Finishing with an Electrode Vibrated with Biaxial Ultrasonic TransducerSynchronous Finish Processes Using Grinding and Ultrasonic Electrochemical Finishing on Hole-Wall SurfaceDevelopment of a Three-Dimensional Tool Oscillation System for Finishing Metal MoldsEngineering a Next Generation Water-Based Grinding FluidEvaluation of Bearing Grinding FluidsThe Correlation and Spectrum Research on Cylindrical Surface Lapping Machined with Abrasive Jet Finishing Restricted by Grinding WheelApplication of a Floating Nozzle to Grinding Process Using an Edge of Grinding WheelA Study on Airflow Field of Super-High Speed Pectination Grinding Wheel Based on PIV Actively Cooled and Activated Coolant for Grinding Brittle MaterialsSpatial Distribution of Cooling Mist for Precision GrindingA Truing Technique of Flattening Diamond Grains for Fabricating Microstructures with Fine SurfacesThe Possibility of Dressless Restoration of Grindactivity in Dry Grinding of CarbonVirtual Truing and Dressing of Grinding WheelEffects of Cutting Edge Truncation on Ultrasonically Assisted GrindingA Preliminary Study of the Erosion Process in Micro-Machining of Glasses with a Low Pressure Slurry JetHole Machining of Glass by Micro Abrasive Suspension JetsSimulation and Analysis of Abrasive Jet Machining with Wheel Restriction in GrindingProfit Optimization of Abrasive Blasting SystemsDesign of Double Nozzle Type Powder Jet Device Optimized for PJDThermal Deformation of Base Sheet and Local Deformation Around Laser Cutting Edge Grinding Combination of Electrochemical Smoothing On SKH 51 Surface Fundamental Study on Influence of Surface Topography on Photocatalytic Reaction Fundamental Research on Generation of Nanostructure by Means of Local Anodic OxidationAn Investigation into Surface Roughness of EDM Using Soft Particles Suspension in Silicone OilAnalysis on the Fracture Failure of Brazed Diamonds in Wire SawingEffects of Thermal Deformation of Multi-Wire Saw?s Wire Guides and Ingot on Slicing Accuracy Study on Glass Strength at High Speed Edge Rounding for LCDThe Deformation Mechanism at Pop-In: Monocrystalline Silicon under Nanoindentation with a Berkovich IndenterMaterial Removal Mechanism of Chemo-Mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (SAGW)Subsurface Structures of Monocrystalline Silicon Generated by NanogrindingComplete Recovery of Subsurface Structures of Machining-Damaged Single Crystalline Silicon by Nd:YAG Laser Irradiation Study on Adhesion Removal Model in CMP SiO2 ILDStudy on the CMP Pad Life with its Mechanical PropertiesPolishing Characteristics on Silicon Wafer Using Fixed Nano-Sized Abrasive Pad A Study on Statistical Analysis of Si-Wafer Polishing Process for the Optimum Polishing ConditionEffect of Conditioning Parameters on Surface Non-Uniformity of Polishing Pad in Chemical Mechanical PlanarizationAchieving a Damage-Free Polishing of Mono-Crystalline SiliconEffect of Polishing Time and Pressure on Polishing Pad PerformancePolishing Characteristics of CMP for Oxygen Free Copper with Manganese Oxide Abrasives Scale Effect of Nano-Indentation of Silicon ? A Molecular Dynamics Investigation
