Auciello / Flamm Plasma Diagnostics

Surface Analysis and Interactions
1. Auflage 2013
ISBN: 978-1-4832-8807-9
Verlag: Elsevier Science & Techn.
Format: PDF
Kopierschutz: 1 - PDF Watermark

E-Book, Englisch, Band Volume 2, 337 Seiten, Web PDF

Reihe: Plasma-Materials Interactions

Plasmas and their interaction with materials have become subjects of major interest because of their importance in modern forefront technologies such as microelectronics, fusion energy, and space. Plasmas are used in microelectronics to process semiconductors (etching of patterns for microcircuits, plasma-induced deposition of thin films, etc.); plasmas produce deleterious erosion effects on surfaces of materials used for fusion devices and spaceships exposed to the low earth environment.Diagnostics of plasmas and materials exposed to them are fundamental to the understanding of the physical and chemical phenomena involved. Plasma Diagnostics provides a comprehensive treatment of the subject.short version, TJE_Plasmas and their interaction with materials have become subjects of major interest because of their importance in modern forefront technologies such as microelectronics, fusion energy, and space. Diagnostics of plasmas and materials exposed to them are fundamental to the understanding of the physical and chemical phenomena involved. Plasma Diagnostics provides a comprehensive treatment of the subject.

Autoren/Hrsg.

Auciello, Orlando

Flamm, Daniel L.

Inhaltsverzeichnis

1;Front Cover;1
2;Surface Analysis and Interactions;4
3;Copyright Page;5
4;Table of Contents;6
5;Contributors;8
6;Preface;10
7;Chapter 1. Quartz Crystal Microbalances for Studies of Plasma-Surface Interactions;12
7.1;I. Introduction;12
7.2;II. Experimental Considerations;14
7.3;III. Applications of Quartz Crystal Microbalances in Reactive Gas Glow Discharges
;20
7.4;IV. Summary and Acknowledgements;28
7.5;References;29
8;Chapter 2. Elemental Analysis of Treated Surfaces;30
8.1;I. Plasma and Surface Analysis;30
8.2;II. Electron Spectroscopy;36
8.3;III. Ion Spectroscopy;57
8.4;References;74
9;Chapter 3. Spectroscopic Ellipsometry in Plasma Processing;78
9.1;I. Introduction;79
9.2;II. Fundamentals;83
9.3;III. Instrumentation—A Spectroscopic Ellipsometric System for Plasma Processing
;90
9.4;IV. Optical Modelling;94
9.5;V. Representative Examples;100
9.6;VI. Conclusion;118
9.7;References;118
10;Chapter 4. Ion Beam Analysis of Plasma-Exposed Surfaces;120
10.1;I. Ion Beam Analysis;121
10.2;II. Rutherford Backscattering Spectrometry (RBS);130
10.3;III. Elastic Recoil Detection (ERD);141
10.4;IV. Particle Induced X-Ray Emission (PIXE);149
10.5;V. Nuclear Reaction Analysis (NRA);156
10.6;VI. Conclusions;164
10.7;References;166
11;Chapter 5. The Interpretation of Plasma Probes for Fusion Experiments;168
11.1;I. Introduction;168
11.2;II. Survey of Probe Techniques;169
11.3;III. Theoretical Basis for Interpretation of Probesin Very Strong Magnetic Fields;171
11.4;IV. Langmuir Probe Interpretation;181
11.5;V. Probe-Size and Limiter-Shadow Effects;196
11.6;VI. Effect of Fluctuations;207
11.7;VII. Impurity Effects;212
11.8;VIII. Remaining Problems;216
11.9;IX. Conclusions;218
11.10;References;218
12;Chapter 6. Analysis of Surfaces Exposed to Plasmas by Nondestructive Photoacoustic and Photothermal Techniques;222
12.1;I. Introduction;223
12.2;II. Basic Theory of Thermal Waves;225
12.3;III. Excitation and Detection Techniques for Thermal Waves;239
12.4;IV. Thermal Wave Analysis of Plasma Treated Materials;254
12.5;V. Thermal Wave Analysis of Plasma-Surface Interactions in Controlled Fusion
;280
12.6;VI. Conclusions;330
12.7;VII. Acknowledgements;331
12.8;References;331
13;Index;338
14;Plasma–Materials Interactions
;349