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E-Book, Englisch, 304 Seiten, Web PDF

Brindley Newnes Electronics Assembly Pocket Book


1. Auflage 2017
ISBN: 978-1-4832-9193-2
Verlag: Elsevier Science & Techn.
Format: PDF
Kopierschutz: 1 - PDF Watermark

E-Book, Englisch, 304 Seiten, Web PDF

ISBN: 978-1-4832-9193-2
Verlag: Elsevier Science & Techn.
Format: PDF
Kopierschutz: 1 - PDF Watermark



Produced in association with the Engineering Training Authority with contributions from dozens of people in the electronics industry. The material covers common skills in electrical and electronic engineering and concentrates mainly on wiring and assembly. 'Newnes Electronics Assembly Pocket Book' is for electronics technicians, students and apprentices.

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Weitere Infos & Material


1;Front Cover;1
2;Electronics Assembly Pocket Book;2
3;Copyright Page;3
4;Table of Contents;6
5;Preface;4
6;Chapter 1. Safety and safe working practice;8
6.1;Interference;8
6.2;Authorised working;8
6.3;Working conditions;8
6.4;Working practices;8
6.5;Emergencies or accidents Personal injury;9
7;Chapter 2. First aid;11
7.1;Procedure in event of accident;11
7.2;First aid to save life;12
7.3;Treatment of electric shock;13
7.4;Electrical burns;14
8;Chapter 3. Fire procedures;15
8.1;General;15
8.2;Fire drills and precautions;15
8.3;Safety;16
8.4;Allocation of fire-fighting equipment;17
9;Chapter 4. Manual lifting techniques;17
9.1;Correct manual lifting techniques;17
9.2;Principal rules for holding and carrying;18
9.3;Protection against injury;19
10;Chapter 5. Standards and specifications;19
10.1;Customer standards;19
10.2;Company standards;19
10.3;National standards;20
10.4;International standards;20
10.5;Use of standards and specifications;20
10.6;Example of standards use;21
11;Chapter 6. Engineering information;22
11.1;Engineering drawings;22
11.2;Circuit diagram;22
11.3;Block diagram;23
11.4;Wiring diagram;23
11.5;Wiring schedule;24
11.6;Wiring layout;24
11.7;Component layout;24
11.8;Sequence chart;24
11.9;Specifications and data sheets;25
12;Chapter 7. Drawings, documentation and practices;25
12.1;Drawing control;25
12.2;Important;26
12.3;Working from drawings or sketches;26
12.4;Freehand sketching;26
12.5;Preparing diagrams;28
13;Chapter 8. Definitions of units;28
13.1;Voltage, current and resistance;28
13.2;Electromotive force and potential difference;28
13.3;Ohm's law;29
13.4;Resistivity;29
13.5;Temperature coefficient of resistance;30
14;Chapter 9. BS3939 electronics symbols;30
15;Chapter 10. Resistors;31
15.1;Tolerance;31
15.2;Stability;31
15.3;Power rating;31
15.4;Resistor types;31
15.5;KirchhofPs laws;36
15.6;Potential divider networks;38
16;Chapter 11. Capacitors;40
16.1;Units of capacitance;43
16.2;Capacitor colour-code;43
16.3;Effect of capacitance in a DC circuit;46
17;Chapter 12. Inductors;49
17.1;Inductors in series;50
17.2;Inductors in parallel;50
17.3;Inductor connected to DC supply;50
17.4;Inductive reactance;51
17.5;Impedance;51
17.6;Identification;51
18;Chapter 13. Electric motors;52
19;Chapter 14. Relays;52
20;Chapter 15. Fuses and circuit breakers;53
21;Chapter 16. Generators;53
22;Chapter 17. Synchros;54
23;Chapter 18. Switches;54
24;Chapter 19. Semiconductors;55
24.1;Copper oxide and selenium rectifiers;55
24.2;Structure of semiconductors;55
24.3;Production of N-type material;56
24.4;Production of P-type material;56
25;Chapter 20. Junction of N- and P-type material;57
26;Chapter 21. Diodes;58
27;Chapter 22. Diode case types;59
28;Chapter 23. Use of junction diodes as rectifiers;61
28.1;Half wave rectifiers;61
28.2;Full wave rectifiers;61
28.3;Full wave rectifiers, bridge-connected;61
28.4;Smoothing;62
28.5;Voltage doubler circuit;62
28.6;Point contact diodes;62
29;Chapter 24. Photodiodes;63
30;Chapter 25. Light emitting diodes;63
31;Chapter 26. Zener diodes;64
32;Chapter 27. Transistors;64
32.1;Construction of junction transistors;65
32.2;Grown junctions;65
32.3;Fused junctions;65
33;Chapter 28. Transistor types;65
34;Chapter 29. Transistor configurations;67
35;Chapter 30. Transistor as an amplifier;69
35.1;Common base configuration;69
35.2;Common emitter configuration;69
35.3;Common collector configurationHere input is to the transistor;70
36;Chapter 31. Feedback;71
36.1;Negative feedback;71
36.2;Positive feedback;71
37;Chapter 32. Stabilisation of transistor amplifiers;71
38;Chapter 33. Multi-stage amplifiers;72
38.1;Multi-stage AC amplifiers;72
38.2;Multi-stage DC amplifiers;73
39;Chapter 34. Transistor as a switch;74
40;Chapter 35. Oscillators;75
41;Chapter 36. Multivibrators;75
41.1;Astable multivibrator;75
41.2;Monostable multivibrator;76
41.3;Bistable multivibrator;77
41.4;Schmitt trigger;77
42;Chapter 37. Other transistors;78
42.1;The unijunction transistor (UJT);78
42.2;Field effect transistor (FET);78
42.3;Junction gate field effect transistor (JUGFET;79
42.4;Insulated gate field effect transistor (IGFET);79
43;Chapter 38. Thyristors;81
43.1;Operating conditions;81
44;Chapter 39. Diacs and triacs;82
45;Chapter 40. Opto-electronics;83
45.1;Signal lamps;83
45.2;Neon;83
45.3;Filament lamps;83
45.4;Liquid crystal displays (LCD;84
45.5;Opto-isolators;84
46;Chapter 41. Integrated circuits;84
47;Chapter 42. Operational amplifiers;87
47.1;Differential input amplifiers;87
47.2;Inverting amplifier;88
48;Chapter 43. Logic;90
48.1;Industrial control systems;90
48.2;Binary system;91
48.3;Decimal/binary/octal conversion table;91
49;Chapter 44. Logic gate symbols;93
50;Chapter 45. Logic modes;94
50.1;The AND function;94
50.2;AND gate truth table;94
50.3;The OR function;95
50.4;The NOR function;97
50.5;Hold or memory circuit;99
50.6;Logic gates;100
51;Chapter 46. Microelectronic devices;101
51.1;Method of production;101
51.2;Quality;103
52;Chapter 47. Thin-film modules;107
53;Chapter 48. Common wire and cables;112
53.1;Single-strand wire;112
53.2;Multi-strand wire;112
53.3;Types of cable;113
53.4;Coaxial cable;114
54;Chapter 49. Current carrying capacity;114
54.1;Wire tables;114
55;Chapter 50. Wire identification;115
55.1;Important;116
55.2;Ribbon cable;116
55.3;Removal of insulation;116
56;Chapter 51. Forming pigtails in coaxial cable braiding;121
57;Chapter 52. Coaxial cable bonding;123
58;Chapter 53. Sleeving;124
58.1;Heat-shrink sleeves;126
59;Chapter 54. Wire terminations;126
59.1;Wiring accessories;128
59.2;Crimped joints;128
60;Chapter 55. Wire-wrapped connections;130
60.1;Wrapping tools;131
60.2;Making a wrapped joint;131
60.3;Bare tinned wire;132
60.4;Insulated wire;133
61;Chapter 56. Connectors;135
61.1;Ribbon cable connectors;136
61.2;Dual-in-line connectors;136
61.3;Multi-pole connectors;136
61.4;Coaxial connectors;138
61.5;Polarisation of connectors;139
62;Chapter 57. Multi-pole connector assembly;139
63;Chapter 58. High-density connector assembly;142
64;Chapter 59. Covers;144
65;Chapter 60. Coaxial connector assembly;145
65.1;Push fit type with a rack or panel mounted socket;145
65.2;Spring fit coaxial type;147
66;Chapter 61. Cable glands;148
67;Chapter 62. Printed circuit boards;149
68;Chapter 63. Nylon screen PCB manufacture;151
69;Chapter 64. Photographic PCB manufacture;152
70;Chapter 65. Etching printed circuit board;153
71;Chapter 66. Edge connectors;154
72;Chapter 67. Roller soldering;154
73;Chapter 68. External connections to printed circuit boards;155
74;Chapter 69. Plated-through hole printed circuit boards;157
74.1;Production;158
75;Chapter 70. Multi-layered printed circuit boards;169
75.1;Advantages;170
76;Chapter 71. Multi-layered board manufacture;172
77;Chapter 72. Number of layers;175
78;Chapter 73. Test and inspection of printed circuit boards;175
78.1;Inspection of multi-layered printed circuit board;177
79;Chapter 74. Handling printed circuit boards;179
80;Chapter 75. Printed circuit board assembly by hand;181
80.1;Care of tools;182
80.2;Assembly methods;183
80.3;Important;184
81;Chapter 76. Specific component assembly requirements;186
81.1;Resistors;186
81.2;Capacitors;189
81.3;Transformers;190
81.4;Relays;191
81.5;Discrete semiconductors;191
81.6;Thin-film integrated circuits;193
81.7;T05 packaged integrated circuits;196
82;Chapter 77. Hand soldering;204
82.1;Electrical maintenance of soldering irons;204
82.2;Mechanical maintenance of soldering irons;204
82.3;Mechanical reinforcement;211
83;Chapter 78. Printed circuit assembly and soldering;219
83.1;Order of component mounting and soldering;220
83.2;Component soldering;223
84;Chapter 79. Reflow soldering;227
85;Chapter 80. Components, piece parts and sub-assemblies;228
86;Chapter 81. Encapsulation of printed circuit boards;232
87;Chapter 82. Repairs to printed circuit boards;233
87.1;Broken track;233
87.2;Lifted track;234
87.3;Components on an encapsulated board;236
88;Chapter 83. Fitting components to front panels;238
89;Chapter 84. Fitting components to chassis;244
90;Chapter 85. Prototype assembly;253
91;Chapter 86. Assembly to standards;266
91.1;The General Assembly (GA);266
91.2;Defect reporting;268
91.3;Use of drawings;269
92;Chapter 87. Cabinet fitting and wiring;270
93;Chapter 88. Adhesives;276
93.1;Epoxy adhesive;277
93.2;Impact (contact) adhesive;277
93.3;Epoxy resins;278
94;Chapter 89. Hand tools;279
95;Chapter 90. Portable electric tools;288
96;Chapter 91. Measuring instruments;291
96.1;Characteristics of measuring instruments;293
97;Chapter 92. Electronic test equipment;294
97.1;Cathode ray oscilloscope;295
97.2;Setting up before use;297
97.3;Measuring frequency;298
97.4;Signal generators;301
98;Index;304



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