Gomatam / Mittal Electrically Conductive Adhesives

Erscheinungsjahr 2012
ISBN: 978-90-04-18782-5
Verlag: Taylor & Francis
Format: PDF
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)

E-Book, Englisch, 426 Seiten

With all the environmental concerns and constraints today and stricter future regulations, there is a patent need to replace materials noxious to the environment by environmentally-friendly alternatives. Electrically conductive adhesives (ECAs) are one such example. ECAs offer an excellent alternative to lead-solder interconnects for microelectronic packaging applications. ECAs are used in electronics for laptop computers, camcorders, watch electronics, hard-drive suspensions and a myriad of electronic equipments. Environmentally-friendly ECAs offer many advantages vis-à-vis solder, such as simple and low-temperature processing conditions, better thermo mechanical performance and finer pitch.
This book is based on the two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to this topic.
The book contains a total of 21 papers (reflecting overviews and original research) and is divided into three parts as follows: Part 1: Introduction and Recent Developments, Part 2: Mechanical, Durability and Reliability Aspects and Part 3: Characterization and Properties.

Autoren/Hrsg.

Gomatam, Rajesh

Mittal, Kash L.

Fachgebiete

• Naturwissenschaften Chemie Physikalische Chemie

Inhaltsverzeichnis

Preface
Part 1: Introduction and Recent Developments
Using Electrically Conductive Inks and Adhesives as a Means to Satisfy European PCB Manufacturing Directives
H. J. Lewis and A. Ryan
An Overview of the Use of Electrically Conductive Adhesives (ECAs) as a Solder Replacement
H. J. Lewis and F. M. Coughlan
Electrically Conductive Adhesives for Electronic Packaging and Assembly Applications
L. J. Matienzo, R. N. Das and F. D. Egitto
Anisotropic Conductive Adhesives for Flip-Chip Interconnects
W. Wang, Y. C. Chan and M. Pecht
Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging
M. J. Yim, Y. Li, K.-s. Moon, K. W. Paik and C. P. Wong
Recent Advances in Developing High Performance Isotropic Conductive Adhesives
D. D. Lu and C. P. Wong
Recent Advances in Nano-conductive Adhesives
D. D. Lu, Y. G. Li and C. P. Wong
Part 2: Mechanical Durability and Reliability Aspects
Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications
Y. C. Lin and X. Chen
Drop Test Performance of Isotropic Electrically Conductive Adhesives
J. E. Morris and J. Lee
Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies.
Part I: Durability of Anisotropically Conductive Adhesive Interconnects
J. Haase, D. Farley, P. Iyer, P. Baumgartner, A. Dasgupta and J. F. J. Caers
Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies.
Part II: Effect of Bump Coplanarity on Manufacturability and Durability of Non-conducting Adhesive Assemblies
D. Farley, A. Dasgupta and J. F. J. Caers
Fatigue Behavior of Electrically Conductive Adhesives
B. Su and J. Qu
Aspect Ratio and Loading Effects of Multiwall Carbon Nanotubes in Epoxy for Electrically Conductive Adhesives
J. Li, J. K. Lumpp, R. Andrews and D. Jacques
Part 3: Characterization and Properties
Novel Techniques for Characterization of Fast-Cure Anisotropic Conductive and Non-conductive Adhesives
M. Teo
Chemorheology of Epoxy/Nickel Conductive Adhesives During Processing and Cure
J. Zhou and E. Sancaktar
Temperature Characterization in Anisotropic Conductive Film Adhesive Bonding
R. L. D. Zenner, C. T. Murray and C. Fisher
Operating Temperature of Anisotropic Conducting Film Adhesives
R. Divigalpitiya
Geometric Effects on Multilayer Generic Circuits Fabricated Using Conductive Epoxy/Nickel Adhesives
J. Zhou and E. Sancaktar
Stable and Unstable Capillary Flows of Highly-Filled Epoxy/Nickel Suspensions
J. Zhou and E. Sancaktar
Electrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles
Y.-S. Lin and S.-S. Chiu
Experimental Investigation and Micropolar Modelling of the Anisotropic Conductive Adhesive Flip-Chip Interconnection
Y. Zhang, J. Liu, R. Larsson and I. Watanabe