E-Book, Englisch, 200 Seiten
Liang / Craven Tribology In Chemical-Mechanical Planarization
Erscheinungsjahr 2010
ISBN: 978-1-4200-2839-3
Verlag: Taylor & Francis
Format: PDF
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)
E-Book, Englisch, 200 Seiten
ISBN: 978-1-4200-2839-3
Verlag: Taylor & Francis
Format: PDF
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)
The role that friction and contact play in the processes of wear and planarization on material surfaces is central to the understanding of Chemical-Mechanical planarization (CMP) technology, particularly when applied to nanosurfaces. Tribology in Chemical-Mechanical Planarization presents a detailed account of the CMP process in a language that is suitable for tribology professionals as well as chemists, materials scientists, physicists, and other applied scientists and engineers in fields of semiconductors and microelectronics. The first half of the book is devoted to CMP, while the other focuses on the fundamentals of tribology.
As the first source to integrate CMP and tribology, the book illustrates the important role that these fields play in manufacturing and technological development. It follows with an examination of tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects. Other topics covered in depth include basics of friction, flash temperature, lubrication fundamentals, basics of wear, polishing particles, and pad wear. The book concludes its focus with CMP practices, discussing mechanical aspects, pad materials, elastic modulus, and cell buckling.
Expanding upon the science and technology of tribology to improve the reliability, maintenance, and wear of technical equipment and other material applications, Tribology in Chemical-Mechanical Planarization provides scientists and engineers with clear foresight to the future of this technology.
Zielgruppe
chemists, materials scientists, electrical and mechanical engineers, physicists, tribologists, and other applied scientists and engineers
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
INTRODUCTION
Brief History of Tribology
CMP Technology Development
Basic CMP Process
SURFACE PROPERTIES
Physical and Mechanical Characteristics of Surfaces
Wear-Contact of Material Structure
Surface Characterization Techniques
CMP Defects
FRICTION
Basics of Friction
Laws of Friction
Friction Due to Adhesion
Friction Due to Abrasion - Ploughing
Friction Due to Deformation
Flash Temperatures
Friction in CMP
LUBRICATION
Lubrication Regimes
Lubrication Fundamentals
Boundary Lubrication in CMP
Lubrication Behavior in Post-CMP Cleaning
Additive Classification for Slurry Design
WEAR IN CMP
Basics of Wear
Slurry Particles
Pad Wear
FORCE TRANSMISSION
CMP Tour de Force
Elastomeric Foams
CMP PADS
Pad Surface Characteristics
Slurry Depletion
Pad Conditioning
POST-CMP CLEANING
