E-Book, Englisch, 700 Seiten
Svendsen Understanding Enzymes
Erscheinungsjahr 2016
ISBN: 978-981-4669-33-7
Verlag: Taylor & Francis
Format: PDF
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)
Function, Design, Engineering, and Analysis
E-Book, Englisch, 700 Seiten
ISBN: 978-981-4669-33-7
Verlag: Taylor & Francis
Format: PDF
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)
Understanding Enzymes: Function, Design, Engineering, and Analysis focuses on the understanding of enzyme function and optimization gained in the past decade, past enzyme function analysis, enzyme engineering, and growing insights from the simulation work and nanotechnology measurement of enzymes in action in vitro or in silico. The book also presents new insights into the mechanistic function and understanding of enzyme reactions, as well as touching upon structural characteristics, including X-ray and nuclear magnetic resonance (NMR) structural methods. A major focus of the book is enzyme molecules’ dependency on dynamic and biophysical environmental impacts on their function in ensembles as well as single molecules. A wide range of readers, including academics, professionals, PhD and master’s students, industry experts, and chemists, will immensely benefit from this exclusive book.
Autoren/Hrsg.
Fachgebiete
- Medizin | Veterinärmedizin Medizin | Public Health | Pharmazie | Zahnmedizin Vorklinische Medizin: Grundlagenfächer Biochemie (med.)
- Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Biotechnologie Medizinische Biotechnologie
- Mathematik | Informatik Mathematik Stochastik
Weitere Infos & Material
Semiconductor fundamentals. GaAs devices. Phase diagrams and crystal growth. Epitaxy. Photolithography. Wet etching. Cleaning and passivation. Plasma processing and dry etching. Deposition. Ion implantation and device isolation. Diffusion. Ohmic contacts. Schottky diodes and FET processing. HEMT process. HBT processing. BiFET and BiHEMT processing. MOSFET processing. Passive components. Interconnect technology. Backside processing and wafer bumping. Electroplating. Measurements and characterization. Reliability. GaN devices and R F MEMs.