Buch, Englisch, Band 58, 480 Seiten, Paperback, Format (B × H): 155 mm x 235 mm, Gewicht: 744 g
Buch, Englisch, Band 58, 480 Seiten, Paperback, Format (B × H): 155 mm x 235 mm, Gewicht: 744 g
Reihe: NATO Science Partnership Subseries: 3
ISBN: 978-90-481-5086-1
Verlag: Springer Netherlands
Topics addressed include processing, interfacial reactions, graded joints, residual stress measurement and analysis, and failure and deformation.
Audience: Academic and industrial researchers and ceramic manufacturers interested in understanding the current state of the art in joining.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Naturwissenschaften Chemie Organische Chemie Polymerchemie
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Verbundwerkstoffe
- Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Keramik- und Glastechnologie
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Werkstoffprüfung
- Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Technologie der Kunststoffe und Polymere
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Polymerwerkstoffe
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Werkstoffkunde, Materialwissenschaft: Forschungsmethoden
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Keramik, Glas, Sonstige Werkstoffe
- Naturwissenschaften Chemie Physikalische Chemie
Weitere Infos & Material
Structure, Composition and Thermal Stability of the Cu/Al2O3 Interface.- Diffusion Bonding of Si3N4-Ceramic to Transition Metals: Interfacial Microchemistry.- Improvement of Wetting and Bonding of Dissimilar Materials.- Wetting and Interfaces in Metal-Oxide Systems: Sensitivity to Experimental Conditions.- Kinetics of Spreading of Some Metal Melts over Covalent Ceramic Surfaces.- Chemical Interaction at the Initial Stage of Spreading.- Wettability Under Non-Reactive and Reactive Conditions in the Systems Ni/YSZ and Ni/Ti-TiO2/YSZ.- Wettability of TiB2 Ceramics by Liquid Cu and Ag-Cu Eutectic Alloys.- The Brazing of Ceramics: Material Science Aspect of Reactive Braze Alloys.- Transient Liquid Phase (TLP) Routes to the Joining of Structural Ceramics.- Joining of Si3N4 Using Al and Ni Interlayers.- Metallic Reaction for Joining of SiC Ceramics.- Alumina-Aluminium Interfaces.- Diffusion Processes at Liquid Metal/Ceramic Interfaces.- Role of Interfacial and Strain Energy for the Formation of Native Metal-Oxide Interfaces.- Phase Formation at Metal-Ceramic Interfaces.- TEM Examinations of B13O2/Al Reaction Zone.- Interfacial Reaction Kinetics of Silicon Nitride/Iron Alloys Diffusion Couples in the Range 1050°C/1250°C.- The Role of Intergranular Phases in Silicon Nitride and Silicon Carbide Direct Joining.- Interdiffusion at Metal/Oxide Interfaces Studied in Thin-Film Structures with AES Depth Profiling.- FT-IR and FT-Raman Study of Surfaces and Thin Layers.- Interfaces and Structural Integrity of Ceramic/Metal Joints: Reliability of Interface.- Fracture Criteria for Interface Cracks. A Case Study.- Interfaces in High-Strength, High-Temperature Ceramic Joints.- Dissipation Analysis of Interface Failure of Bimaterials.- Calculation and Experimental Determination of theResidual Stresses in a Metal-Ceramic Bond.- Application of the Blister Test to Adhesion Energy Measurements in Metal/Ceramic Film-on-Substrate Systems.- Microstructure, Mechanical Properties and Stability of Brazed Metal/Ceramic Systems: Technological Aspects and Testing Methodologies.- Joining of Silicon Nitride Ceramics to Titanium Alloy with an Interlayer.- Layered Composites — Relationship between Residual Stresses and Fracture Behaviour.- Adhesion in Steel/Silicate Glass System.- Reactive Coatings on Ceramic Substrates.- Fabrication of Metal/Oxide Ceramic Functionally Graded Materials by Slip Casting.- The Joining of Alumina Membranes.- Joining Ceramics Using Preceramic Polymers.- The Importance of the Ceramic Interface in Electronic Applications.- Interaction of MLC BaTiO3 Based Ceramic with Silver Termination Ink.- Influence of Boundaries on Ionic Conductance.- Interface Effects in Ferroelectric Thin Films.- Characterisation of the Metal-Ceramic Direct Soldering by the Metal-Metal Diffusion Method.- Auhor Index.