Buch, Englisch, 130 Seiten, Format (B × H): 170 mm x 240 mm, Gewicht: 410 g
Buch, Englisch, 130 Seiten, Format (B × H): 170 mm x 240 mm, Gewicht: 410 g
ISBN: 978-3-03835-252-5
Verlag: Trans Tech Publications
Autoren/Hrsg.
Weitere Infos & Material
Preface and Committees
Chapter 1: Development and Prototyping
Method for the Identification and Comparison of Alternative Process Chains Focusing on Economics Efficiency Analysis during the Conceptual Design of Mechatronic Integrated Devices
Novel Approach for the Implementation of 3D-MID Compatible Routing Functionalities into Computer-Aided Design Tools
Optimized Process Sequences for Prototyping of Molded Interconnect Devices
Integration of Functional Circuits into FDM Parts
Chapter 2: Printing Technologies
Printing of Functional Structures on Molded 3D Devices
Electrical Functionalization of Thermoplastics by Combining Plasmadust Coating and Aerosol Jet Printing
Production of Miniaturized Sensor Structures on Polymer Substrates Using Inkjet Printing
Progress in the Manufacturing of Molded Interconnected Devices by 3D Microcontact Printing
Chapter 3: Materials and Manufacturing
Characterization of Electromagnetic Properties of MID Materials for High Frequency Applications up to 67 GHz
Novel Laser Induced Metallization for Three Dimensional Molded Interconnect Device Applications by Spray Method
Experimental Investigation of Laser Sintering of Conductive Adhesive for Functional Prototypes Produced by Embedding Stereolithography
MID Fabricated by Ultrasonic Processing
Usage of Industrial Robots as Flexible Handling Devices Supporting the Process of Three Dimensional Conductive Pattern Generation
Chapter 4: Manufacturing Processes
Study of MID Technologies for Automotive Lighting and Light Signaling Devices
Chapter 5: Assembly Technologies and Inspection
Design and Solder Process Optimization in MID Technology for High Power Applications
Chapter 6: Quality and Reliability
Hot Pin Pull Method – New Test Procedure for the Adhesion Measurement for 3D-MID
