Advanced Microsystems for Automotive Applications Yearbook 2002

Softcover Nachdruck of the original 1. Auflage 2002
ISBN: 978-3-642-62114-7
Verlag: Springer

Buch, Englisch, 338 Seiten, Paperback, Format (B × H): 155 mm x 235 mm, Gewicht: 546 g

Reihe: VDI-Buch

Microsystems are an important success factor in the automobile industry. In order to fulfil the customers requests for safety convenience and vehicle economy, and to satisfy environmental requirements, microsystems are becoming indispensable. Thus a large number of microsystem applications came into the discussion. With the international conference AMAA 2002, VDI/VDE-IT provides a platform for the discussion of all MST relevant components for automotive applications. The conference proceedings gather the papers by authors from automobile suppliers and manufacturers.

Zielgruppe

Research

Autoren/Hrsg.

Gessner, Wolfgang

Krueger, Sven

Fachgebiete

• Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik Fertigungstechnik
• Technische Wissenschaften Verkehrstechnik | Transportgewerbe Fahrzeugtechnik
• Technische Wissenschaften Energietechnik | Elektrotechnik Elektrotechnik
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik

Inhaltsverzeichnis

1 Microsystems for Automotive Applications: Markets and Perspectives.- 1.1 Markets and Opportunities for MEMS/MST in Automotive Applications.- 1.2 The Automotive Microsystems Market: Insights from the NEXUS Market Study 20012.- 1.3 Automotive Micro and Nano- Technology in the European Sixth Framework Programme.- 1.4 Regulations for Automotive Applications.- 2 Microsystems Technologies and Materials.- 2.1 Microsystems Technology — a New Era Leading to Unequalled Potentials for Automotive Applications.- 2.2 Fabrication Technologies for 3D-microsensor Structures.- 2.3 Signal Processing for Automotive Applications.- 2.4 Materials for Electronic Systems in Automotive Applications — Silicon On Insulator (SOI).- 2.5 Microsystems Packaging for Automotive Applications.- 2.6 Micro-Mechatronics in Automotive Applications.- 3 Functions and Applications.- 3.1 Towards Ambient Intelligence — Obstacle Detection.- 3.1.1 Overview: Obstacle Detection.- 3.1.2 Environment Sensing for Advanced Driver Assistance — CARSENSE.- 3.1.3 True 360° Sensing Using Multiple Systems.- 3.1.4 Electronic Scanning Antenna for Autonomous Cruise Control Applications.- 3.1.5 Advanced Uncooled Infrared System Electronics.- 3.1.6 Laserscanner for Obstacle Detection.- 3.1.7 Infrared Camera for cAR — ICAR a EURIMUS Project for Driver Vision Enhancement.- 3.1.8 Micro-Opto-Electro-Mechanical-Ssystems (MOEMS) in Automotive Applications.- 3.2 Powertrain Applications.- 3.2.1 Overview: Microsystems as a Key Eelement for Advanced Powertrain Systems.- 3.2.2 A Piezoelectric Driven Microinjector for Dl-Gasoline Applications.- 3.2.3 A Robust Hot Film Anemometer for Injection Quantity Measurements.- 3.2.4 Non-Contact Magnetostrictive Torque Sensor — Opportunities and Realisation.- 3.2.5 Benefits of a CylinderPressure Based Engine Management System on a Vehicle.- 3.3 Measurement — Angle and Position Sensors for Vehicles.- 3.3.1 TPO (True Power On) Active Camshaft Sensor for Low Emission Regulation.- 3.3.2 Contactless Position Sensors for Safety-critical Applications.- 3.3.3 High Resolution Absolute Angular Position Detection with Single Chip Capability.- 3.4 Measurement — Pressure Sensing in Automotive Applications.- 3.3.4 Programmable Linear Magnetic Hall-Effect Sensor with Excellent Accuracy.- 3.4.1 Overview: Principles and Technologies for Pressure Sensors for Automotive Applications.- 3.4.2 Tire Pressure Monitoring Systems — the New MEMS Based Safety Issue.- 3.4.3 Measurement of the Actuation Force of the Brake Pedal in Brake-by-wire Systems Via the Use of Micromechanical Sensors.- 3.4.4 Design of a New Concept Pressure Sensor for X-by-wire Automotive Applications.- 3.4.5 Pressure Sensors in the Pressure Range 0 — 300 bar for Oil Pressure Applications — Directly in the Oil Media.- 3.5 Further Functions and Applications.- 3.5.1 Sensors in the Next Generation Automotive Networks.- 3.5.2 Plastic Packaging for Various Sensor Applications in the Automotive Industry.- 3.5.3 Harsh Fluid Resistant Silicone Encapsulants for the Automotive Industry.- 3.5.4 Silicon-On-lnsulator (SOI) Solutions for Automotive Applications.- 3.5.5 Micromachined Gyroscope in Silicon-On-lnsulator (SOI) Technology.- 3.5.6 Thermal Microsensor for the Detection of Side-Impacts in Vehicles.- 3.5.7 Low-cost Filling-level Sensor.- 3.5.8 IBA — Integrated Bus Compatible Initiator.- Contributors.- Keywords.