The 2nd International Conference on Electronic Materials and InformationEngineering, April 15-17, 2022 in Hangzhou, China
Sonstiges, Englisch, 1263 Seiten, Format (B × H): 124 mm x 140 mm, Gewicht: 54 g
ISBN: 978-3-8007-5961-3
Verlag: VDE Verlag
This year, the 2nd International Conference on Electronic Materials and Information Engineering (EMIE 2022) will be held on April 15-17, 2022 in Hangzhou, China. We are also honoured to have Prof. CHING YERN CHEE from University of Malaya, Malaysia; Prof. Wenbo Liu from Sichuan University, China and Prof. Baoyou Liu from Hebei University of Science and Technology, China as our keynote speakers.
The success and prosperity of the conference is reflected in the high level of papers received. The proceedings are a compilation of accepted papers and represent an interesting outcome of the conference. EMIE 2022 for exchange of research findings, analysis, information, and knowledge in areas which include but are not limited to: Electronic Materials, Information Engineering and other related topics. We hope that EMIE 2022 will be a forum for excellent discussions that will put forward new ideas and promote collaborative researches. We are sure that the proceedings will serve as an important research source of references and the knowledge, which will lead to not only scientific and engineering progress but also other new products and processes.
Xie
EMIE 2022, CD-ROM jetzt bestellen!
The success and prosperity of the conference is reflected in the high level of papers received. The proceedings are a compilation of accepted papers and represent an interesting outcome of the conference. EMIE 2022 for exchange of research findings, analysis, information, and knowledge in areas which include but are not limited to: Electronic Materials, Information Engineering and other related topics. We hope that EMIE 2022 will be a forum for excellent discussions that will put forward new ideas and promote collaborative researches. We are sure that the proceedings will serve as an important research source of references and the knowledge, which will lead to not only scientific and engineering progress but also other new products and processes.
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Elektronik, Optik
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Leistungselektronik
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Elektronische Baugruppen, Elektronische Materialien
- Technische Wissenschaften Elektronik | Nachrichtentechnik Nachrichten- und Kommunikationstechnik
- Mathematik | Informatik EDV | Informatik Computerkommunikation & -vernetzung
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